Inventor · disambiguated record
Andrew C. Mcneil
Also filed as: MCNEIL ANDREW C
52 granted patents·10 pending applications·1,070 citations·filing 1994–2022
98Inventor score
Top patents by PatentIndex Score
62 records- 0198US7121141B2Z-axis accelerometer with at least two gap sizes and travel stops disposed outside an active capacitor areaFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Oct 17, 2006·123 cites·19 claims
- 0298US6845670B1Single proof mass, 3 axis MEMS transducerFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jan 25, 2005·127 cites·46 claims
- 0395US8387464B2Laterally integrated MEMS sensor device with multi-stimulus sensingMCNEIL ANDREW C·Filed 2009·Granted Mar 5, 2013·43 cites·19 claims
- 0495US8020443B2Transducer with decoupled sensing in mutually orthogonal directionsFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Sep 20, 2011·44 cites·20 claims
- 0595US7610809B2Differential capacitive sensor and method of making sameFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Nov 3, 2009·51 cites·14 claims
- 0695US7487661B2Sensor having free fall self-test capability and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Feb 10, 2009·27 cites·14 claims
- 0794US8555719B2MEMS sensor with folded torsion springsMCNEIL ANDREW C·Filed 2011·Granted Oct 15, 2013·15 cites·19 claims
- 0894US8539836B2MEMS sensor with dual proof massesMCNEIL ANDREW C·Filed 2011·Granted Sep 24, 2013·17 cites·14 claims
- 0994US7578190B2Symmetrical differential capacitive sensor and method of making sameFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Aug 25, 2009·54 cites·16 claims
- 1094US6936492B2Single proof mass, 3 axis MEMS transducerFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Aug 30, 2005·48 cites·14 claims
- 1192US9689677B2MEMS device with common mode rejection structureFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jun 27, 2017·11 cites·20 claims
- 1290US10712359B2Flexure with enhanced torsional stiffness and MEMS device incorporating sameNXP USA INC·Filed 2018·Granted Jul 14, 2020·4 cites·18 claims
- 1390US8056415B2Semiconductor device with reduced sensitivity to package stressMCNEIL ANDREW C·Filed 2008·Granted Nov 15, 2011·22 cites·9 claims
- 1490US5888412AMethod for making a sculptured diaphragmMOTOROLA INC·Filed 1996·Granted Mar 30, 1999·79 cites·15 claims
- 1589US9790085B1Actively preventing charge induced leakage of semiconductor devicesFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Oct 17, 2017·8 cites·12 claims
- 1689US7637160B2MEMS suspension and anchoring designFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Dec 29, 2009·21 cites·18 claims
- 1788US8925384B2MEMS sensor with stress isolation and method of fabricationMCNEIL ANDREW C·Filed 2012·Granted Jan 6, 2015·8 cites·20 claims
- 1888US8096182B2Capacitive sensor with stress relief that compensates for package stressLIN YIZHEN·Filed 2008·Granted Jan 17, 2012·16 cites·20 claims
- 1985US6840106B1Sensor using an actuator for self-test and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jan 11, 2005·28 cites·29 claims
- 2084US9290067B2Pressure sensor with differential capacitive outputMCNEIL ANDREW C·Filed 2012·Granted Mar 22, 2016·3 cites·14 claims
- 2183US8610222B2MEMS device with central anchor for stress isolationLIN YIZHEN·Filed 2011·Granted Dec 17, 2013·6 cites·20 claims
- 2283US7628072B2MEMS device and method of reducing stiction in a MEMS deviceFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Dec 8, 2009·12 cites·20 claims
- 2382US9638712B2MEMS device with over-travel stop structure and method of fabricationFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted May 2, 2017·3 cites·16 claims
- 2482US6472243B2Method of forming an integrated CMOS capacitive pressure sensorMOTOROLA INC·Filed 2000·Granted Oct 29, 2002·39 cites·12 claims
- 2582US5994161ATemperature coefficient of offset adjusted semiconductor device and method thereofMOTOROLA INC·Filed 1997·Granted Nov 30, 1999·71 cites·21 claims
- 2681US8921952B2Microelectromechanical system devices having crack resistant membrane structures and methods for the fabrication thereofDAWSON CHAD S·Filed 2013·Granted Dec 30, 2014·5 cites·16 claims
- 2780US6465320B1Electronic component and method of manufacturingMOTOROLA INC·Filed 2000·Granted Oct 15, 2002·24 cites·26 claims
- 2879US9190937B2Stiction resistant mems device and method of operationFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Nov 17, 2015·4 cites·9 claims
- 2978US9506756B2Multiple axis rate sensorFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Nov 29, 2016·6 cites·17 claims
- 3078US8186220B2Accelerometer with over-travel stop structureGEISBERGER AARON A·Filed 2009·Granted May 29, 2012·9 cites·13 claims
- 3175US8468887B2Resonant accelerometer with low sensitivity to package stressMCNEIL ANDREW C·Filed 2008·Granted Jun 25, 2013·7 cites·20 claims
- 3274US5900530AMethod for testing pressure sensorsMOTOROLA INC·Filed 1997·Granted May 4, 1999·32 cites·19 claims
- 3368US6352874B1Method of manufacturing a sensorMOTOROLA INC·Filed 1999·Granted Mar 5, 2002·27 cites·19 claims
- 3467US10107701B2Pressure sensor with differential capacitive outputFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Oct 23, 2018·1 cites·3 claims
- 3564US9500669B2System and method for calibrating an inertial sensorFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Nov 22, 2016·1 cites·20 claims
- 3662US8739627B2Inertial sensor with off-axis spring systemLI GARY G·Filed 2011·Granted Jun 3, 2014·3 cites·18 claims
- 3762US6122963AElectronic component for measuring accelerationMOTOROLA INC·Filed 1999·Granted Sep 26, 2000·22 cites·17 claims
- 3860US9131325B2MEMS device assembly and method of packaging sameSCHLARMANN MARK E·Filed 2012·Granted Sep 8, 2015·1 cites·6 claims
- 3958US10794701B2Inertial sensor with single proof mass and multiple sense axis capabilityNXP USA INC·Filed 2018·Granted Oct 6, 2020·0 cites·20 claims
- 4058US7005193B2Method of adding mass to MEMS structuresMOTOROLA INC·Filed 2003·Granted Feb 28, 2006·7 cites·37 claims
- 4158US5461774AApparatus and method of elastically bowing a base plateMOTOROLA INC·Filed 1994·Granted Oct 31, 1995·31 cites·19 claims
- 4256US9103705B2Combined environmental parameter sensorBILIC DUBRAVKA·Filed 2012·Granted Aug 11, 2015·2 cites·14 claims
- 4355US9573799B2MEMS device having variable gap width and method of manufactureFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Feb 21, 2017·0 cites·19 claims
- 4455US2024192072A1System for reading pressure of a pressure sensor and method thereforNXP USA INC·Filed 2022·Application pending·0 cites
- 4552US9926187B2Microelectromechanical system devices having crack resistant membrane structures and methods for the fabrication thereofDAWSON CHAD S·Filed 2014·Granted Mar 27, 2018·0 cites·18 claims
- 4649US11029327B2Inertial sensor with suspension spring structure surrounding anchorNXP USA INC·Filed 2018·Granted Jun 8, 2021·0 cites·12 claims
- 4747US11726107B2Inertial sensor sampling with combined sense axesNXP USA INC·Filed 2020·Granted Aug 15, 2023·0 cites·14 claims
- 4847US2022089435A9Redundant sensor system with self-test of electromechanical structuresNXP USA INC·Filed 2019·Application pending·0 cites
- 4946US11499987B2Z-axis inertial sensor with extended motion stopsNXP USA INC·Filed 2020·Granted Nov 15, 2022·0 cites·12 claims
- 5046US8927311B2MEMS device having variable gap width and method of manufactureMCNEIL ANDREW C·Filed 2011·Granted Jan 6, 2015·0 cites·14 claims
Showing the top 50 of 62 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →