Inventor · disambiguated record
Andreas Muller-Hipper
Also filed as: MUELLER-HIPPER ANDREAS · MULLER-HIPPER ANDREAS
6 granted patents·6 pending applications·60 citations·filing 2003–2006
82Inventor score
Top patents by PatentIndex Score
12 records- 0182US7240847B2Chip cardCIRCLE SMART CARD AG·Filed 2005·Granted Jul 10, 2007·22 cites·7 claims
- 0280US7192509B2Process for producing a metal structure in foam form, a metal foam, and an arrangement having a carrier substrate and a metal foamINFINEON TECHNOLOGIES AG·Filed 2005·Granted Mar 20, 2007·4 cites·18 claims
- 0375US6984446B2Process for producing a metal layer on a substrate body, and substrate body having a metal layerINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jan 10, 2006·10 cites·12 claims
- 0469US6946958B2Contactless data storage mediumINFINEON TECHNOLOGIES AG·Filed 2003·Granted Sep 20, 2005·18 cites·5 claims
- 0563US7451936B2Module for contactless chip cards or identification systemsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Nov 18, 2008·2 cites·21 claims
- 0654US7100836B2Module for contactless chip cards or identification systemsINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 5, 2006·4 cites·5 claims
- 0749US2007082127A1Process for producing a structured metal layer on a substrate bodyINFINEON TECHNOLOGIES AG·Filed 2006·Application pending·0 cites
- 0846US2005061661A1Electrodeposition device and electrodeposition system for coating structures which have already been made conductiveINFINEON TECHNOLOGIES AG·Filed 2004·Application pending·0 cites
- 0943US2006043200A1Chip card moduleINFINEON TECHNOLOGIES AG·Filed 2005·Application pending·0 cites
- 1042US2006043575A1Chip moduleINFINEON TECHNOLOGIES AG·Filed 2005·Application pending·0 cites
- 1142US2005272249A1Method and system for producing conductive patterns on a substrateINFINEON TECHNOLOGIES AG·Filed 2005·Application pending·0 cites
- 1239US2005034995A1Process for producing a structured metal layer on a substrate body, and substrate body having a structured metal layerINFINEON TECHNOLOGIES AG·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →