Inventor · disambiguated record
Andreas Ostmann
Also filed as: OSTMANN ANDREAS
13 granted patents·1 pending application·115 citations·filing 1995–2018
91Inventor score
Top patents by PatentIndex Score
14 records- 0182US11394109B2Module arrangement comprising embedded components and an integrated antenna, device comprising module arrangements, and method for manufacturingFRAUNHOFER GES FORSCHUNG·Filed 2018·Granted Jul 19, 2022·4 cites·26 claims
- 0281US8861220B2Method for generating an electronic system, method for generating a freeform surface having such a system, and electronic system and freeform surfaces having such a systemLÖHER THOMAS·Filed 2010·Granted Oct 14, 2014·16 cites·25 claims
- 0372US8975116B2Electronic assembly including an embedded electronic componentOSTMANN ANDREAS·Filed 2010·Granted Mar 10, 2015·5 cites·19 claims
- 0470US7011989B2Method for producing encapsulated chipsFRAUNHOFER GES FORSCHUNG·Filed 2003·Granted Mar 14, 2006·21 cites·19 claims
- 0568US6277660B1Method and apparatus for testing chipsFRAUNHOFER GES FORSCHUNG·Filed 2000·Granted Aug 21, 2001·12 cites·10 claims
- 0662US9243341B2Device and method for producing targeted flow and current density patterns in a chemical and/or electrolytic surface treatmentDIETRICH LOTHAR·Filed 2011·Granted Jan 26, 2016·2 cites·11 claims
- 0762US5989993AMethod for galvanic forming of bonding padsZAKEL ELKE·Filed 1996·Granted Nov 23, 1999·30 cites·14 claims
- 0855US8042724B2Method for electrically connecting to a contact of a microelectronic component on a circuit board or substrateFRAUNHOFER GES FORSCHUNG·Filed 2007·Granted Oct 25, 2011·1 cites·20 claims
- 0948US8654536B2Expandable circuit carrierOSTMANN ANDREAS·Filed 2007·Granted Feb 18, 2014·1 cites·4 claims
- 1048US6211571B1Method and apparatus for testing chipsFRAUNHOFER GES FORSCHUNG·Filed 1996·Granted Apr 3, 2001·12 cites·11 claims
- 1143US2008074856A1Electronic SubassemblyFRAUNHOFER GES FORSCHUNG·Filed 2007·Application pending·0 cites
- 1240US11563266B2Module arrangement comprising an integrated antenna and embedded components and method for manufacturing a module arrangementFRAUNHOFER GES FORSCHUNG·Filed 2018·Granted Jan 24, 2023·0 cites·15 claims
- 1334US6284639B1Method for forming a structured metallization on a semiconductor waferFRAUNHOFER GES FORSCHUNG·Filed 1999·Granted Sep 4, 2001·5 cites·15 claims
- 1434US5956232AChip support arrangement and chip support for the manufacture of a chip casingFRAUNHOFER GES FORSCHUNG·Filed 1995·Granted Sep 21, 1999·6 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →