Inventor · disambiguated record
Andres Ramirez Macias
Also filed as: RAMIREZ MACIAS ANDRES
2 granted patents·5 pending applications·2 citations·filing 2019–2024
38Inventor score
Top patents by PatentIndex Score
7 records- 0177US12293956B2Boiling enhancement structures for immersion cooled electronic systemsINTEL CORP·Filed 2021·Granted May 6, 2025·1 cites·24 claims
- 0260US11495518B2Multi-surface heat sink suitable for multi-chip packagesINTEL CORP·Filed 2019·Granted Nov 8, 2022·1 cites·16 claims
- 0353US2025218909A1Environmental sealing for electronics chip package socketsINTEL CORP·Filed 2023·Application pending·0 cites
- 0452US2024349457A1Damping assemblies for heat sinks and related methodsGENG PHIL·Filed 2024·Application pending·0 cites
- 0549US2024297119A1Liquid metal connection device and methodINTEL CORP·Filed 2021·Application pending·0 cites
- 0648US2023027076A1Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 0738US2022117114A1Immersion cooling system with phoretic force particulate collectionINTEL CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →