Inventor · disambiguated record
Anca Stefanescu
Also filed as: STEFANESCU ANCA
2 granted patents·2 pending applications·80 citations·filing 2000–2015
66Inventor score
Files withMEMC ELECTRONIC MATERIALS1RIES MICHAEL J1STEFANESCU ANCA1SUNEDISON SEMICONDUCTOR LTD UEN201334164H1
Top patents by PatentIndex Score
4 records- 0192US8859393B2Methods for in-situ passivation of silicon-on-insulator wafersRIES MICHAEL J·Filed 2011·Granted Oct 14, 2014·64 cites·5 claims
- 0267US6600557B1Method for the detection of processing-induced defects in a silicon waferMEMC ELECTRONIC MATERIALS·Filed 2000·Granted Jul 29, 2003·16 cites·24 claims
- 0339US2012247686A1Systems and Methods For Ultrasonically Cleaving A Bonded Wafer PairSTEFANESCU ANCA·Filed 2012·Application pending·0 cites
- 0438US2015126017A1Systems and methods for ultrasonically cleaving a bonded wafer pairSUNEDISON SEMICONDUCTOR LTD UEN201334164H·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →