Inventor · disambiguated record
An-Jhih Su
Also filed as: SU AN-JHIH
185 granted patents·40 pending applications·1,742 citations·filing 2010–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD220SU AN-JHIH1TAIWAN SEMICONDUCTOR MFG1TAIWAN SEMICONDUCTOR MNAUFACTRUING COMPANY LTD1WANG TZU-YU1
Top patents by PatentIndex Score
225 records- 0199US11721559B2Integrated circuit package pad and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 8, 2023·4 cites·20 claims
- 0299US11527419B2Photonic integrated package and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·7 cites·20 claims
- 0399US11469215B2Chip package structure with molding layer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 11, 2022·7 cites·20 claims
- 0499US11444021B2Device and package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·5 cites·20 claims
- 0599US11276656B2Integrated fan-out structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 15, 2022·12 cites·20 claims
- 0699US10784248B2Multi-stack package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 22, 2020·46 cites·20 claims
- 0799US10658337B2Packages and packaging methods for semiconductor devices, and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 19, 2020·37 cites·20 claims
- 0899US10490540B2Multi-stack package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 26, 2019·44 cites·20 claims
- 0999US9859245B1Chip package structure with bump and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·48 cites·20 claims
- 1099US9812337B2Integrated circuit package pad and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 7, 2017·66 cites·20 claims
- 1199US9735131B2Multi-stack package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 15, 2017·721 cites·20 claims
- 1298US11482497B2Package structure including a first die and a second die and a bridge die and method of forming the package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 25, 2022·7 cites·20 claims
- 1398US10347606B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 9, 2019·19 cites·20 claims
- 1498US10163803B1Integrated fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·42 cites·20 claims
- 1598US10090284B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 2, 2018·43 cites·20 claims
- 1698US9859258B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·40 cites·20 claims
- 1798US9825007B1Chip package structure with molding layer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 21, 2017·21 cites·17 claims
- 1898US9728498B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 8, 2017·39 cites·20 claims
- 1997US12033949B2Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 9, 2024·3 cites·20 claims
- 2097US11961800B2Via for semiconductor device connection and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 16, 2024·2 cites·20 claims
- 2197US11842983B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 12, 2023·3 cites·20 claims
- 2297US11251071B2Raised via for terminal connections on different planesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·4 cites·20 claims
- 2397US10811394B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 20, 2020·10 cites·20 claims
- 2497US10083927B2Chip package structure with bumpTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 25, 2018·12 cites·20 claims
- 2597US9793246B1Pop devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 17, 2017·30 cites·20 claims
- 2697US9484227B1Dicing in wafer level packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 1, 2016·20 cites·20 claims
- 2796US12283492B2Photonic integrated package and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 22, 2025·1 cites·20 claims
- 2896US12062602B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 13, 2024·3 cites·20 claims
- 2996US10879224B2Package structure, die and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·15 cites·20 claims
- 3096US10777430B2Photonic integrated package and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 15, 2020·8 cites·20 claims
- 3196US10157852B2Multi-stacked package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 18, 2018·9 cites·20 claims
- 3296US9793231B2Under bump metallurgy (UBM) and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 17, 2017·15 cites·19 claims
- 3396US9646955B2Packages and methods of forming packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 9, 2017·16 cites·20 claims
- 3496US9583415B2Packages with thermal interface material on the sidewalls of stacked diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 28, 2017·30 cites·19 claims
- 3595US11901196B2Method for forming photonic integrated packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·1 cites·20 claims
- 3695US11587900B2Package structure including IPD and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·3 cites·20 claims
- 3795US10854565B2Chip package structure with bumpTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 1, 2020·7 cites·20 claims
- 3895US10157899B2Packages and methods of forming packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·9 cites·20 claims
- 3995US10103125B2Chip package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 16, 2018·10 cites·20 claims
- 4095US9984998B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·9 cites·20 claims
- 4195US9831215B1Semiconductor package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 28, 2017·13 cites·20 claims
- 4295US9806059B1Multi-stack package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 31, 2017·11 cites·20 claims
- 4394US12327819B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 10, 2025·1 cites·20 claims
- 4494US11854994B2Redistribution structure for integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 4594US11462531B2Multi-stack package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 4, 2022·2 cites·20 claims
- 4694US10096553B2Metal pad for laser markingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 9, 2018·9 cites·20 claims
- 4794US9640496B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 2, 2017·11 cites·17 claims
- 4893US11177142B2Method for dicing integrated fan-out packages without seal ringsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 16, 2021·10 cites·20 claims
- 4993US11133258B2Package with bridge die for interconnection and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 28, 2021·9 cites·19 claims
- 5093US10636775B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 28, 2020·6 cites·20 claims
Showing the top 50 of 225 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →