Inventor · disambiguated record
Annie Tay
Also filed as: TAY ANNIE
6 granted patents·1 pending application·1 citations·filing 2016–2019
65Inventor score
Top patents by PatentIndex Score
7 records- 0166US11051391B2Thermally highly conductive coating on base structure accommodating a componentAT & S CHINA CO LTD·Filed 2018·Granted Jun 29, 2021·1 cites·19 claims
- 0242US10455704B2Method for copper filling of a hole in a component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Oct 22, 2019·0 cites·15 claims
- 0338US10779415B2Component embedding in thinner core using dielectric sheetAT & S CHINA CO LTD·Filed 2017·Granted Sep 15, 2020·0 cites·18 claims
- 0437US10973133B2Sacrificial structure with dummy core and two sections of separate material thereon for manufacturing component carriersAT & S CHINA CO LTD·Filed 2016·Granted Apr 6, 2021·0 cites·20 claims
- 0536US11116083B2Electronic component embedded by laminate sheetAT & S CHINA CO LTD·Filed 2017·Granted Sep 7, 2021·0 cites·18 claims
- 0633US11051410B2Component carriers sandwiching a sacrificial structure and having pure dielectric layers next to the sacrificial structureAT & S CHINA CO LTD·Filed 2016·Granted Jun 29, 2021·0 cites·19 claims
- 0733US2020006135A1Method and Plater Arrangement for Failure-Free Copper Filling of a Hole in a Component CarrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →