Inventor · disambiguated record
Andy Quang Tran
Also filed as: TRAN ANDY QUANG
15 granted patents·6 pending applications·30 citations·filing 2012–2023
90Inventor score
Top patents by PatentIndex Score
21 records- 0191US9171830B2Fabricating a proximity sensor having light-blocking structure in leadframeTEXAS INSTRUMENTS INC·Filed 2015·Granted Oct 27, 2015·8 cites·5 claims
- 0288US9768098B2Packaged semiconductor device having stacked attached chips overhanging the assembly padTEXAS INSTRUMENTS INC·Filed 2016·Granted Sep 19, 2017·6 cites·8 claims
- 0385US9373569B1Flat no-lead packages with electroplated edgesTEXAS INSTRUMENTS INC·Filed 2015·Granted Jun 21, 2016·4 cites·9 claims
- 0482US9515059B2Proximity sensor having light-blocking structure in leadframe and method of making sameTEXAS INSTRUMENTS INC·Filed 2015·Granted Dec 6, 2016·3 cites·5 claims
- 0573US2023377124A1Exposed pad integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0672US11769247B2Exposed pad integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2021·Granted Sep 26, 2023·0 cites·21 claims
- 0772US9219019B2Packaged semiconductor devices having solderable lead surfaces exposed by grooves in package compoundTEXAS INSTRUMENTS INC·Filed 2014·Granted Dec 22, 2015·3 cites·5 claims
- 0870US9608158B2Proximity sensor having light-blocking structure in leadframe and method of making sameTEXAS INSTRUMENTS INC·Filed 2016·Granted Mar 28, 2017·1 cites·3 claims
- 0969US9576886B1Flat no-lead packages with electroplated edgesTEXAS INSTRUMENTS INC·Filed 2016·Granted Feb 21, 2017·1 cites·7 claims
- 1065US8994154B2Proximity sensor having light blocking structure in leadframeTEXAS INSTRUMENTS INC·Filed 2013·Granted Mar 31, 2015·1 cites·3 claims
- 1165US8769469B1System and method of crossover determination in differential pair and bondwire pairs to minimize crosstalkHOWARD GREGORY ERIC·Filed 2012·Granted Jul 1, 2014·3 cites·14 claims
- 1263US10580723B2Flat no-lead packages with electroplated edgesTEXAS INSTRUMENTS INC·Filed 2019·Granted Mar 3, 2020·0 cites·20 claims
- 1354US10366947B2Flat no-lead packages with electroplated edgesTEXAS INSTRUMENTS INC·Filed 2017·Granted Jul 30, 2019·0 cites·8 claims
- 1452US2016181180A1Packaged semiconductor device having attached chips overhanging the assembly padTEXAS INSTRUMENTS INC·Filed 2014·Application pending·0 cites
- 1551US11195269B2Exposed pad integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2015·Granted Dec 7, 2021·0 cites·15 claims
- 1651US2015262918A1Structure and method of packaged semiconductor devices with bent-lead qfn leadframesTEXAS INSTRUMENTS INC·Filed 2014·Application pending·0 cites
- 1745US10541194B2Semiconductor package with interconnected leadsTEXAS INSTRUMENTS INC·Filed 2018·Granted Jan 21, 2020·0 cites·17 claims
- 1845US2016005712A1Structure and method of packaged semiconductor devices with bent-lead qfn leadframesTEXAS INSTRUMENTS INC·Filed 2015·Application pending·0 cites
- 1943US2015262919A1Structure and method of packaged semiconductor devices with qfn leadframes having stress-absorbing protrusionsTEXAS INSTRUMENTS INC·Filed 2014·Application pending·0 cites
- 2036US9721859B2Semi-hermetic semiconductor packageTEXAS INSTRUMENTS INC·Filed 2015·Granted Aug 1, 2017·0 cites·20 claims
- 2133US2016071788A1Packaged semiconductor devices having solderable lead surfaces exposed by grooves in package compoundTEXAS INSTRUMENTS INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →