Inventor · disambiguated record

Anshih Tseng

Also filed as: TSENG ANSHIH

1 granted patent·2 pending applications·0 citations·filing 2023–2023

9Inventor score

Technology areasH10W

Files withQUALCOMM INC3

Top patents by PatentIndex Score

3 records

0155US12476228B2Wafer level packaging process for thin film inductorsQUALCOMM INC·Filed 2023·Granted Nov 18, 2025·0 cites·28 claims
0254US2024258364A1Wafer level packaging process for thin film inductorsQUALCOMM INC·Filed 2023·Application pending·0 cites
0353US2025096117A1Integrated circuits including stacked thin film inductors and methods of fabricationQUALCOMM INC·Filed 2023·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →