Inventor · disambiguated record
Andre Uhlemann
Also filed as: UHLEMANN ANDRE
11 granted patents·3 pending applications·144 citations·filing 2011–2023
88Inventor score
Top patents by PatentIndex Score
14 records- 0196US8963321B2Semiconductor device including cladded base plateINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 24, 2015·88 cites·35 claims
- 0293US9275926B2Power module with cooling structure on bonding substrate for cooling an attached semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 1, 2016·22 cites·15 claims
- 0389US11266012B2Circuit board, chip cooling housing, assembly and method for cooling a semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2019·Granted Mar 1, 2022·7 cites·13 claims
- 0482US9578789B2Power semiconductor module with liquid coolingINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 21, 2017·11 cites·12 claims
- 0580US8519532B2Semiconductor device including cladded base plateLENNIGER ANDREAS·Filed 2011·Granted Aug 27, 2013·9 cites·14 claims
- 0677US11631974B2Snubber circuit and power semiconductor module with snubber circuitINFINEON TECHNOLOGIES AG·Filed 2020·Granted Apr 18, 2023·1 cites·18 claims
- 0777US9731370B2Directly cooled substrates for semiconductor modules and corresponding manufacturing methodsINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 15, 2017·4 cites·8 claims
- 0866US11778735B2Circuit board having a cooling area above and below a semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2022·Granted Oct 3, 2023·0 cites·20 claims
- 0957US11810889B2External contact element for a power semiconductor module and power semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2022·Granted Nov 7, 2023·0 cites·20 claims
- 1055US2023317560A1Power semiconductor module, system including a power semiconductor module and a cooler and method for fabricating a systemINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1154US8872332B2Power module with directly attached thermally conductive structuresUHLEMANN ANDRE·Filed 2012·Granted Oct 28, 2014·2 cites·12 claims
- 1249US11598904B2Power semiconductor module and method for producing a power semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2019·Granted Mar 7, 2023·0 cites·5 claims
- 1347US2017304922A1Directly Cooled Substrates for Semiconductor ModulesINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 1434US2016056088A1Cold Plate, Device Comprising a Cold Plate and Method for Fabricating a Cold PlateINFINEON TECHNOLOGIES AG·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →