Inventor · disambiguated record
Arsalan Alam
Also filed as: ALAM ARSALAN
3 granted patents·12 pending applications·0 citations·filing 2019–2024
40Inventor score
Top patents by PatentIndex Score
15 records- 0155US12334488B2Stacking power delivery device diesADVANCED MICRO DEVICES INC·Filed 2021·Granted Jun 17, 2025·0 cites·20 claims
- 0253US2025246580A1Integrated circuit die stack with a bridge dieADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 0353US2025246519A1Integrated circuit die stack with a dual-sided bridge dieADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 0452US2025118706A1Chip package with a thermal carrierADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 0552US2025167192A1Integrated circuit die stack with a bridge dieADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 0651US2025098184A1Hybrid methods and structures for increasing capacitance density in integrated passive devicesADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 0751US2025096161A1Methods and structures for increasing capacitance density in integrated passive devicesADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 0851US2024047228A1Methods for constructing package substrates with high densityADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 0950US11239542B2Network on interconnect fabric and integrated antennaUNIV CALIFORNIA·Filed 2020·Granted Feb 1, 2022·0 cites·24 claims
- 1050US2023120305A1Testing a semiconductor die using temporary test pads applied to conductive pads of the semiconductor dieADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 1149US2025323212A1Systems and methods for stack construction of a semiconductor device having redistribution layers in a silicon carrierADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 1248US2025293210A1Systems and methods for packaging a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 1347US11538764B2Flexible and stretchable interconnects for flexible systemsUNIV CALIFORNIA·Filed 2019·Granted Dec 27, 2022·0 cites·16 claims
- 1447US2025233087A1Systems and methods for embedding electronic components in substratesADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 1546US2023197623A1Electronic device including an integrated circuit die and a support structureADVANCED MICRO DEVICES INC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →