Inventor · disambiguated record
Aravindha R. Antoniswamy
Also filed as: ANTONISWAMY ARAVINDHA · ANTONISWAMY ARAVINDHA R
12 granted patents·8 pending applications·29 citations·filing 2014–2023
85Inventor score
Files withINTEL CORP20
Top patents by PatentIndex Score
20 records- 0191US9515003B1Embedded air core inductors for integrated circuit package substrates with thermal conductorINTEL CORP·Filed 2015·Granted Dec 6, 2016·18 cites·20 claims
- 0281US9330999B2Multi-component integrated heat spreader for multi-chip packagesINTEL CORP·Filed 2014·Granted May 3, 2016·7 cites·11 claims
- 0377US11894282B2Vented lids for integrated circuit packagesINTEL CORP·Filed 2019·Granted Feb 6, 2024·2 cites·20 claims
- 0461US10969840B2Heat spreaders with interlocked insertsINTEL CORP·Filed 2015·Granted Apr 6, 2021·1 cites·21 claims
- 0561US10763188B2Integrated heat spreader having electromagnetically-formed featuresINTEL CORP·Filed 2015·Granted Sep 1, 2020·1 cites·4 claims
- 0655US2025106983A1Stiffener architectures for glass edge protectionINTEL CORP·Filed 2023·Application pending·0 cites
- 0753US10236233B2Heat spreaders with integrated preformsINTEL CORP·Filed 2017·Granted Mar 19, 2019·0 cites·20 claims
- 0852US11881438B2First-level integration of second-level thermal interface material for integrated circuit assembliesINTEL CORP·Filed 2020·Granted Jan 23, 2024·0 cites·18 claims
- 0951US11923268B2Printed heat spreader structures and methods of providing sameINTEL CORP·Filed 2020·Granted Mar 5, 2024·0 cites·19 claims
- 1051US9799584B2Heat spreaders with integrated preformsINTEL CORP·Filed 2015·Granted Oct 24, 2017·0 cites·16 claims
- 1151US2024222288A1Socket interface frames for devices with improved-performance substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 1247US11869824B2Thermal interface structures for integrated circuit packagesINTEL CORP·Filed 2019·Granted Jan 9, 2024·0 cites·25 claims
- 1344US11581240B2Liquid thermal interface material in electronic packagingINTEL CORP·Filed 2018·Granted Feb 14, 2023·0 cites·20 claims
- 1442US2021125896A1Filled liquid metal thermal interface materialsINTEL CORP·Filed 2019·Application pending·0 cites
- 1542US2021020537A1Integrated heat spreader (ihs) with solder thermal interface material (stim) bleed-out restricting featureINTEL CORP·Filed 2019·Application pending·0 cites
- 1641US11004768B2Multi-chip package with partial integrated heat spreaderINTEL CORP·Filed 2019·Granted May 11, 2021·0 cites·15 claims
- 1741US2021028084A1Variable-thickness integrated heat spreader (ihs)INTEL CORP·Filed 2019·Application pending·0 cites
- 1835US2019304805A1Electronic device and method for manufacturing the sameINTEL CORP·Filed 2018·Application pending·0 cites
- 1931US2019043778A1Swaging process for complex integrated heat spreadersINTEL CORP·Filed 2015·Application pending·0 cites
- 2031US2019027379A1Sintered heat spreaders with insertsINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →