Inventor · disambiguated record
Arata Endo
Also filed as: ENDO ARATA
5 granted patents·2 pending applications·12 citations·filing 2011–2015
72Inventor score
Top patents by PatentIndex Score
7 records- 0182US9822226B2Dry film and printed wiring boardTAIYO INK MFG CO LTD·Filed 2015·Granted Nov 21, 2017·3 cites·19 claims
- 0277US9188871B2Pattern forming method, alkali-developable thermosetting resin composition, printed circuit board and manufacturing method thereofTAIYO INK MFG CO LTD·Filed 2013·Granted Nov 17, 2015·3 cites·17 claims
- 0375US9068100B2Thermosetting resin composition, cured product thereof, and printed wiring board using the sameTAIYO INK MFG CO LTD·Filed 2012·Granted Jun 30, 2015·2 cites·17 claims
- 0469US9596754B2Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrateTAIYO INK MFG CO LTD·Filed 2012·Granted Mar 14, 2017·4 cites·20 claims
- 0550US9796810B2Heat-curable composition, dry film, and printed wiring boardTAIYO INK MFG CO LTD·Filed 2014·Granted Oct 24, 2017·0 cites·20 claims
- 0642US2015041181A1Process for the preparation of printed wiring board, laminate, laminate film and non-curable resin composition used for the printed wiring board, and printed wiring board prepared by the processTAIYO INK MFG CO LTD·Filed 2014·Application pending·0 cites
- 0737US2013192886A1Thermosetting filling resin compositionENDO ARATA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →