Inventor · disambiguated record
Arifur Rahman
Also filed as: RAHMAN ARIFUR
100 granted patents·5 pending applications·2,825 citations·filing 2002–2022
99Inventor score
Top patents by PatentIndex Score
105 records- 0199US7723207B2Three dimensional integrated circuit and method of designIBM·Filed 2007·Granted May 25, 2010·277 cites·13 claims
- 0299US7312487B2Three dimensional integrated circuitIBM·Filed 2004·Granted Dec 25, 2007·335 cites·11 claims
- 0398US9331062B1Integrated circuits with backside power deliveryALTERA CORP·Filed 2013·Granted May 3, 2016·57 cites·16 claims
- 0498US9059696B1Interposer with programmable power gating granularityALTERA CORP·Filed 2013·Granted Jun 16, 2015·61 cites·17 claims
- 0598US7619441B1Apparatus for interconnecting stacked dice on a programmable integrated circuitXILINX INC·Filed 2008·Granted Nov 17, 2009·68 cites·20 claims
- 0698US7518398B1Integrated circuit with through-die via interface for die stackingXILINX INC·Filed 2007·Granted Apr 14, 2009·62 cites·18 claims
- 0798US7218168B1Linear voltage regulator with dynamically selectable driversXILINX INC·Filed 2005·Granted May 15, 2007·77 cites·20 claims
- 0897US9847783B1Scalable architecture for IP block integrationALTERA CORP·Filed 2015·Granted Dec 19, 2017·46 cites·17 claims
- 0997US9583431B12.5D electronic packageALTERA CORP·Filed 2014·Granted Feb 28, 2017·63 cites·19 claims
- 1097US8237274B1Integrated circuit package with redundant micro-bumpsRAHMAN ARIFUR·Filed 2010·Granted Aug 7, 2012·48 cites·20 claims
- 1197US7884398B2Floating gate field effect transistors for chemical and/or biological sensingPOLITECHNIC INST UNIV NEW YORK·Filed 2008·Granted Feb 8, 2011·76 cites·21 claims
- 1297US7477072B1Circuit for and method of enabling partial reconfiguration of a device having programmable logicXILINX INC·Filed 2006·Granted Jan 13, 2009·79 cites·17 claims
- 1397US7462512B2Floating gate field effect transistors for chemical and/or biological sensingUNIV POLYTECHNIC·Filed 2005·Granted Dec 9, 2008·191 cites·7 claims
- 1497US7310459B1On-chip programmable optical crossbar switchXILINX INC·Filed 2005·Granted Dec 18, 2007·62 cites·18 claims
- 1596US8941233B1Integrated circuit package with inter-die thermal spreader layersNGAI TONY·Filed 2012·Granted Jan 27, 2015·34 cites·13 claims
- 1696US8063654B2Apparatus and method for testing of stacked die structureRAHMAN ARIFUR·Filed 2009·Granted Nov 22, 2011·56 cites·20 claims
- 1796US7973555B1Configuration interface to stacked FPGAXILINX INC·Filed 2008·Granted Jul 5, 2011·43 cites·11 claims
- 1896US7930661B1Software model for a hybrid stacked field programmable gate arrayXILINX INC·Filed 2008·Granted Apr 19, 2011·53 cites·15 claims
- 1996US7701057B1Semiconductor device having structures for reducing substrate noise coupled from through die viasXILINX INC·Filed 2007·Granted Apr 20, 2010·42 cites·18 claims
- 2096US7500060B1Hardware stack structure using programmable logicXILINX INC·Filed 2007·Granted Mar 3, 2009·97 cites·19 claims
- 2196US7498835B1Implementation of low power standby modes for integrated circuitsXILINX INC·Filed 2005·Granted Mar 3, 2009·47 cites·19 claims
- 2295US9935052B1Power line layout in integrated circuitsALTERA CORP·Filed 2014·Granted Apr 3, 2018·21 cites·16 claims
- 2395US8356138B1Methods for implementing programmable memory controller for distributed DRAM system-in-package (SiP)XILINX INC·Filed 2007·Granted Jan 15, 2013·45 cites·20 claims
- 2495US8159263B1Programmable integrated circuit with voltage domainsTUAN TIM·Filed 2010·Granted Apr 17, 2012·21 cites·20 claims
- 2595US7605458B1Method and apparatus for integrating capacitors in stacked integrated circuitsXILINX INC·Filed 2007·Granted Oct 20, 2009·30 cites·10 claims
- 2695US7477073B1Structures and methods for heterogeneous low power programmable logic deviceXILINX INC·Filed 2006·Granted Jan 13, 2009·35 cites·17 claims
- 2794US9971733B1Scalable 2.5D interface circuitryALTERA CORP·Filed 2015·Granted May 15, 2018·9 cites·18 claims
- 2894US9330823B1Integrated circuit structure with inductor in silicon interposerRAHMAN ARIFUR·Filed 2011·Granted May 3, 2016·14 cites·17 claims
- 2994US9129935B1Multi-chip packages with reduced power distribution network noiseCHANDRASEKAR KARTHIK·Filed 2012·Granted Sep 8, 2015·65 cites·18 claims
- 3094US8415783B1Apparatus and methodology for testing stacked dieRAHMAN ARIFUR·Filed 2007·Granted Apr 9, 2013·33 cites·18 claims
- 3194US7989959B1Method of forming stacked-die integrated circuitXILINX INC·Filed 2009·Granted Aug 2, 2011·36 cites·15 claims
- 3294US7701251B1Methods and apparatus for implementing a stacked memory programmable integrated circuit system in packageXILINX INC·Filed 2008·Granted Apr 20, 2010·35 cites·11 claims
- 3393US10504819B2Integrated circuit package with enhanced cooling structureALTERA CORP·Filed 2015·Granted Dec 10, 2019·11 cites·20 claims
- 3493US7463056B1Writeable shift register lookup table in FPGA with SRAM memory cells in lookup table reprogrammed by writing after initial configurationXILINX INC·Filed 2005·Granted Dec 9, 2008·28 cites·19 claims
- 3592US10482060B2Methods and apparatus for controlling interface circuitryALTERA CORP·Filed 2018·Granted Nov 19, 2019·5 cites·19 claims
- 3692US8648615B2Testing die-to-die bonding and reworkRAHMAN ARIFUR·Filed 2010·Granted Feb 11, 2014·11 cites·16 claims
- 3792US7863092B1Low cost bumping and bonding method for stacked dieXILINX INC·Filed 2008·Granted Jan 4, 2011·26 cites·19 claims
- 3892US7368946B1Level-shifting pass gate multiplexerXILINX INC·Filed 2006·Granted May 6, 2008·25 cites·19 claims
- 3990US11281605B2Integrated circuit device with embedded programmable logicALTERA CORP·Filed 2020·Granted Mar 22, 2022·2 cites·20 claims
- 4090US8933345B1Method and apparatus for monitoring through-silicon viasRAHMAN ARIFUR·Filed 2010·Granted Jan 13, 2015·11 cites·21 claims
- 4190US8089299B1Integrated circuit with through-die via interface for die stacking and cross-track routingRAHMAN ARIFUR·Filed 2009·Granted Jan 3, 2012·18 cites·20 claims
- 4289US9136842B2Integrated circuit device with embedded programmable logicALTERA CORP·Filed 2013·Granted Sep 15, 2015·7 cites·20 claims
- 4389US8384225B2Through silicon via with improved reliabilityXILINX INC·Filed 2010·Granted Feb 26, 2013·13 cites·18 claims
- 4488US8933447B1Method and apparatus for programmable device testing in stacked die applicationsRAHMAN ARIFUR·Filed 2010·Granted Jan 13, 2015·10 cites·15 claims
- 4588US8332803B1Method and apparatus for integrated circuit package thermo-mechanical reliability analysisRAHMAN ARIFUR·Filed 2010·Granted Dec 11, 2012·12 cites·20 claims
- 4687US8156456B1Unified design methodology for multi-die integrated circuitsRAHMAN ARIFUR·Filed 2010·Granted Apr 10, 2012·15 cites·20 claims
- 4787US7998853B1Semiconductor device with through substrate viasXILINX INC·Filed 2009·Granted Aug 16, 2011·14 cites·15 claims
- 4887US6967500B1Electronic circuit with on-chip programmable terminationsLATTICE SEMICONDUCTOR CORP·Filed 2003·Granted Nov 22, 2005·36 cites·21 claims
- 4987US6788101B1Programmable interface circuit for differential and single-ended signalsLATTICE SEMICONDUCTOR CORP·Filed 2003·Granted Sep 7, 2004·50 cites·19 claims
- 5086US7417454B1Low-swing interconnections for field programmable gate arraysXILINX INC·Filed 2005·Granted Aug 26, 2008·15 cites·16 claims
Showing the top 50 of 105 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →