Inventor · disambiguated record
Aram Rezikyan
Also filed as: REZIKYAN ARAM
0 granted patents·3 pending applications·0 citations·filing 2019–2024
Files withCORNING INC3
Top patents by PatentIndex Score
3 records- 0177US2024140864A13d interposer with through glass vias - method of increasing adhesion between copper and glass surfaces and articles therefromCORNING INC·Filed 2024·Application pending·0 cites
- 0275US2024429375A1Sintered cathodes having coated surfacesCORNING INC·Filed 2024·Application pending·0 cites
- 0372US2020148593A13d interposer with through glass vias - method of increasing adhesion between copper and glass surfaces and articles therefromCORNING INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →