Inventor · disambiguated record
Archana Venugopal
Also filed as: VENUGOPAL ARCHANA
45 granted patents·20 pending applications·91 citations·filing 2014–2025
97Inventor score
Files withTEXAS INSTRUMENTS INC65
Top patents by PatentIndex Score
65 records- 0196US9882008B2Graphene FET with graphitic interface layer at contactsTEXAS INSTRUMENTS INC·Filed 2015·Granted Jan 30, 2018·12 cites·15 claims
- 0296US9793214B1Heterostructure interconnects for high frequency applicationsTEXAS INSTRUMENTS INC·Filed 2017·Granted Oct 17, 2017·18 cites·20 claims
- 0393US10748999B2Multi-super lattice for switchable arraysTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 18, 2020·6 cites·20 claims
- 0492US9397023B2Integration of heat spreader for beol thermal managementTEXAS INSTRUMENTS INC·Filed 2014·Granted Jul 19, 2016·11 cites·8 claims
- 0591US11390527B2Multi-layered SP2-bonded carbon tubesTEXAS INSTRUMENTS INC·Filed 2018·Granted Jul 19, 2022·3 cites·20 claims
- 0691US10304967B1Integration of graphene and boron nitride hetero-structure device over semiconductor layerTEXAS INSTRUMENTS INC·Filed 2018·Granted May 28, 2019·5 cites·20 claims
- 0790US2025066526A1Filler particles for polymersTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0889US2025386558A1High voltage avalanche diode for active clamp driversTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0988US10069065B2Low noise graphene hall sensors, systems and methods of making and using sameTEXAS INSTRUMENTS INC·Filed 2015·Granted Sep 4, 2018·4 cites·13 claims
- 1088US9698075B2Integration of backside heat spreader for thermal managementTEXAS INSTRUMENTS INC·Filed 2016·Granted Jul 4, 2017·5 cites·14 claims
- 1186US11854933B2Thermally conductive wafer layerTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 26, 2023·1 cites·17 claims
- 1286US10001529B2Low-offset Graphene Hall sensorTEXAS INSTRUMENTS INC·Filed 2015·Granted Jun 19, 2018·3 cites·20 claims
- 1385US10256188B2Interconnect via with grown graphitic materialTEXAS INSTRUMENTS INC·Filed 2016·Granted Apr 9, 2019·3 cites·16 claims
- 1484US12389640B2High voltage avalanche diode for active clamp driversTEXAS INSTRUMENTS INC·Filed 2024·Granted Aug 12, 2025·0 cites·18 claims
- 1584US12139569B2Filler particles for polymersTEXAS INSTRUMENTS INC·Filed 2022·Granted Nov 12, 2024·0 cites·16 claims
- 1683US11145598B2Lattice bump interconnectTEXAS INSTRUMENTS INC·Filed 2018·Granted Oct 12, 2021·3 cites·18 claims
- 1783US10804201B2Dissimilar material interface having latticesTEXAS INSTRUMENTS INC·Filed 2018·Granted Oct 13, 2020·3 cites·19 claims
- 1881US10181521B2Graphene heterolayers for electronic applicationsTEXAS INSTRUMENTS INC·Filed 2017·Granted Jan 15, 2019·3 cites·16 claims
- 1980US10490673B2Integration of graphene and boron nitride hetero-structure deviceTEXAS INSTRUMENTS INC·Filed 2018·Granted Nov 26, 2019·2 cites·20 claims
- 2080US2024246317A1SP2-Bonded Carbon StructuresTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2179US10593763B2Graphene FET with graphitic interface layer at contactsTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 17, 2020·1 cites·20 claims
- 2279US2024312862A1Thermal routing trench by additive processingTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2378US11254775B2Filler particles for polymersTEXAS INSTRUMENTS INC·Filed 2018·Granted Feb 22, 2022·0 cites·12 claims
- 2478US10181516B2Graphene FET with graphitic interface layer at contactsTEXAS INSTRUMENTS INC·Filed 2018·Granted Jan 15, 2019·1 cites·20 claims
- 2577US11370662B2Hexagonal boron nitride structuresTEXAS INSTRUMENTS INC·Filed 2018·Granted Jun 28, 2022·0 cites·5 claims
- 2677US9496198B2Integration of backside heat spreader for thermal managementTEXAS INSTRUMENTS INC·Filed 2014·Granted Nov 15, 2016·3 cites·9 claims
- 2775US2022250909A1Hexagonal boron nitride structuresTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2873US11984475B2High voltage avalanche diode for active clamp driversTEXAS INSTRUMENTS INC·Filed 2021·Granted May 14, 2024·0 cites·19 claims
- 2973US2024153841A1Thermally conductive wafer layerTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 3073US2025287843A1Embedded thermoelectric cooler using thermally anisotropic mesas for power device heat generating source temperature reductionTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 3172US10923567B2Graphene FET with graphitic interface layer at contactsTEXAS INSTRUMENTS INC·Filed 2020·Granted Feb 16, 2021·0 cites·19 claims
- 3271US12501633B2Breakdown diodes and methods of making the sameTEXAS INSTRUMENTS INC·Filed 2022·Granted Dec 16, 2025·0 cites·28 claims
- 3371US11996343B2Thermal routing trench by additive processingTEXAS INSTRUMENTS INC·Filed 2020·Granted May 28, 2024·0 cites·22 claims
- 3470US12342719B2Embedded thermoelectric cooler using thermally anisotropic mesas for power device heat generating source temperature reductionTEXAS INSTRUMENTS INC·Filed 2022·Granted Jun 24, 2025·0 cites·33 claims
- 3570US2023243770A1Gas sensor with superlattice structureTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 3670US2023307312A1High thermal conductivity vias by additive processingTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 3769US12500082B2Semicondctor device package thermal conduitTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 16, 2025·0 cites·25 claims
- 3869US11676880B2High thermal conductivity vias by additive processingTEXAS INSTRUMENTS INC·Filed 2016·Granted Jun 13, 2023·1 cites·24 claims
- 3969US11004680B2Semiconductor device package thermal conduitTEXAS INSTRUMENTS INC·Filed 2016·Granted May 11, 2021·1 cites·20 claims
- 4066US11309388B2Multi-super lattice for switchable arraysTEXAS INSTRUMENTS INC·Filed 2020·Granted Apr 19, 2022·0 cites·9 claims
- 4166US10811334B2Integrated circuit nanoparticle thermal routing structure in interconnect regionTEXAS INSTRUMENTS INC·Filed 2016·Granted Oct 20, 2020·1 cites·13 claims
- 4265US11938715B2SP2-bonded carbon structuresTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 26, 2024·0 cites·6 claims
- 4365US10529641B2Integrated circuit nanoparticle thermal routing structure over interconnect regionTEXAS INSTRUMENTS INC·Filed 2016·Granted Jan 7, 2020·1 cites·16 claims
- 4461US11081593B2Integration of graphene and boron nitride hetero-structure deviceTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 3, 2021·0 cites·19 claims
- 4561US2025311284A1Semiconductor devices with alternating insulating layers and methods of fabrication thereofTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 4661US2025311390A1Diodes with False Collectors Sandwiching and Tied to AnodeTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 4760US2024321677A1Semiconductor devices with thermoelectric coolerTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 4858US11296237B2Integration of graphene and boron nitride hetero-structure device over semiconductor layerTEXAS INSTRUMENTS INC·Filed 2019·Granted Apr 5, 2022·0 cites·21 claims
- 4958US10861763B2Thermal routing trench by additive processingTEXAS INSTRUMENTS INC·Filed 2016·Granted Dec 8, 2020·0 cites·9 claims
- 5058US10790228B2Interconnect via with grown graphitic materialTEXAS INSTRUMENTS INC·Filed 2019·Granted Sep 29, 2020·0 cites·20 claims
Showing the top 50 of 65 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →