Inventor · disambiguated record
Arisa Yamakawa
Also filed as: YAMAKAWA ARISA
0 granted patents·2 pending applications·0 citations·filing 2021–2024
Technology areasH05K
Files withRESONAC CORP2
Top patents by PatentIndex Score
2 records- 0152US2025362600A1Photosensitive resin composition, photosensitive element, printed wiring board, and method for manufacturing printed wiring boardRESONAC CORP·Filed 2024·Application pending·0 cites
- 0242US2024337934A1Photosensitive resin composition, photosensitive element, printed wiring board, and method for producing printed wiring boardRESONAC CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →