Inventor · disambiguated record
Ashay Dani
Also filed as: DANI ASHAY · DANI ASHAY A
26 granted patents·20 pending applications·422 citations·filing 2001–2024
97Inventor score
Top patents by PatentIndex Score
46 records- 0194US6926955B2Phase change material containing fusible particles as thermally conductive fillerINTEL CORP·Filed 2002·Granted Aug 9, 2005·45 cites·15 claims
- 0292US7332807B2Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing sameINTEL CORP·Filed 2005·Granted Feb 19, 2008·26 cites·19 claims
- 0392US7014093B2Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making sameINTEL CORP·Filed 2003·Granted Mar 21, 2006·41 cites·24 claims
- 0491US7294394B2Phase change material containing fusible particles as thermally conductive fillerINTEL CORP·Filed 2005·Granted Nov 13, 2007·18 cites·6 claims
- 0588US7960019B2Phase change material containing fusible particles as thermally conductive fillerINTEL CORP·Filed 2007·Granted Jun 14, 2011·19 cites·12 claims
- 0685US7473995B2Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assemblyINTEL CORP·Filed 2002·Granted Jan 6, 2009·39 cites·12 claims
- 0784US7311967B2Thermal interface material and electronic assembly having such a thermal interface materialINTEL CORP·Filed 2001·Granted Dec 25, 2007·28 cites·28 claims
- 0883US7252877B2Polymer matrices for polymer solder hybrid materialsINTEL CORP·Filed 2003·Granted Aug 7, 2007·18 cites·28 claims
- 0982US8701281B2Substrate metallization and ball attach metallurgy with a novel dopant elementSIDHU RAJEN S·Filed 2009·Granted Apr 22, 2014·11 cites·7 claims
- 1082US7253523B2Reworkable thermal interface materialINTEL CORP·Filed 2003·Granted Aug 7, 2007·28 cites·29 claims
- 1181US6974723B2Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materialsINTEL CORP·Filed 2004·Granted Dec 13, 2005·25 cites·3 claims
- 1280US7527090B2Heat dissipating device with preselected designed interface for thermal interface materialsINTEL CORP·Filed 2003·Granted May 5, 2009·24 cites·13 claims
- 1380US6841867B2Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materialsINTEL CORP·Filed 2002·Granted Jan 11, 2005·24 cites·19 claims
- 1479US8703286B2Polymer matrices for polymer solder hybrid materialsJAYARAMAN SAIKUMAR·Filed 2011·Granted Apr 22, 2014·5 cites·12 claims
- 1577US7846778B2Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assemblyINTEL CORP·Filed 2002·Granted Dec 7, 2010·24 cites·7 claims
- 1675US6974726B2Silicon wafer with soluble protective coatingINTEL CORP·Filed 2003·Granted Dec 13, 2005·25 cites·11 claims
- 1772US7996989B2Heat dissipating device with preselected designed interface for thermal interface materialsINTEL CORP·Filed 2008·Granted Aug 16, 2011·4 cites·3 claims
- 1867US9247686B2Polymer matrices for polymer solder hybrid materialsINTEL CORP·Filed 2014·Granted Jan 26, 2016·1 cites·17 claims
- 1967US7776657B2Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing sameINTEL CORP·Filed 2007·Granted Aug 17, 2010·3 cites·10 claims
- 2065US7967942B2Polymer matrices for polymer solder hybrid materialsINTEL CORP·Filed 2007·Granted Jun 28, 2011·2 cites·3 claims
- 2162US9613933B2Package structure to enhance yield of TMI interconnectionsDE BONIS THOMAS J·Filed 2014·Granted Apr 4, 2017·2 cites·20 claims
- 2261US7030483B2Polymer solder hybrid interface material with improved solder filler particle size and microelectronic package applicationINTEL CORP·Filed 2003·Granted Apr 18, 2006·9 cites·20 claims
- 2358US9024453B2Functional material systems and processes for package-level interconnectsSIDHU RAJEN S·Filed 2012·Granted May 5, 2015·1 cites·30 claims
- 2458US2025218999A1Passive component assembly for thickness modification to match core thicknessINTEL CORP·Filed 2023·Application pending·0 cites
- 2558US2025218998A1Low temperature solder interconnect for package pitch scalingINTEL CORP·Filed 2023·Application pending·0 cites
- 2658US2025279384A1Methods and apparatus using polymer material to fill gaps between semiconductor diesINTEL CORP·Filed 2024·Application pending·0 cites
- 2757US2025218958A1Pedestals for semiconductor components embedded in package substrates and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 2857US2025218926A1Microelectronic assemblies including cavity-less encapsulated diesINTEL CORP·Filed 2023·Application pending·0 cites
- 2956US2025112085A1Apparatus and methods for capillary underfill of embedded devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 3055US2025106983A1Stiffener architectures for glass edge protectionINTEL CORP·Filed 2023·Application pending·0 cites
- 3154US2006124700A1Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making sameINTEL CORP·Filed 2006·Application pending·0 cites
- 3254US2024222301A1Methods and apparatus for optical thermal treatment in semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 3354US2024222136A1Electrical layer with roughened surfacesINTEL CORP·Filed 2022·Application pending·0 cites
- 3453US2025112136A1Glass core protection using peripheral buffer layersINTEL CORP·Filed 2023·Application pending·0 cites
- 3552US10049971B2Package structure to enhance yield of TMI interconnectionsINTEL CORP·Filed 2017·Granted Aug 14, 2018·0 cites·3 claims
- 3651US2024203853A1Dry film photoresist wet lamination and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 3751US2024222283A1Methods and apparatus to prevent over-etch in semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 3849US2023317653A1Hybrid bonding a die to a substrate with vias connecting metal pads on both sides of the dieINTEL CORP·Filed 2022·Application pending·0 cites
- 3943US11335616B2Substrate integrated inductor with composite magnetic resin layerINTEL CORP·Filed 2017·Granted May 17, 2022·0 cites·25 claims
- 4043US2014175160A1Solder paste material technology for elimination of high warpage surface mount assembly defectsSIDHU RAJEN S·Filed 2012·Application pending·0 cites
- 4141US2004244952A1Integrated heat spreader with mechanical interlock designsINTEL CORP·Filed 2004·Application pending·0 cites
- 4240US2007152325A1Chip package dielectric sheet for body-biasingINTEL CORP·Filed 2005·Application pending·0 cites
- 4340US2006289966A1Silicon wafer with non-soluble protective coatingDANI ASHAY A·Filed 2005·Application pending·0 cites
- 4439US2003131975A1Integrated heat spreader with mechanical interlock designsFiled 2002·Application pending·0 cites
- 4535US7727815B2Reactive gettering in phase change solders to inhibit oxidation at contact surfacesINTEL CORP·Filed 2004·Granted Jun 1, 2010·0 cites·15 claims
- 4635US2020203067A1Magnetic core/shell particles for inductor arraysINTEL CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →