Inventor · disambiguated record
Ashish Dhall
Also filed as: DHALL ASHISH
6 granted patents·4 pending applications·8 citations·filing 2015–2024
75Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0196US11664290B2Package with underfill containment barrierINTEL CORP·Filed 2021·Granted May 30, 2023·3 cites·20 claims
- 0289US11158558B2Package with underfill containment barrierINTEL CORP·Filed 2016·Granted Oct 26, 2021·5 cites·16 claims
- 0384US12327773B2Package with underfill containment barrierINTEL CORP·Filed 2024·Granted Jun 10, 2025·0 cites·20 claims
- 0480US11935805B2Package with underfill containment barrierINTEL CORP·Filed 2023·Granted Mar 19, 2024·0 cites·20 claims
- 0559US2025309192A13d die stacking with hybrid bonding and through dielectric via structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 0658US2025293137A13d die stack redistribution layer for topside power delivery to backside die metallization in multichip composite devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 0748US10269695B2Method for forming an electrical device and electrical devicesINTEL CORP·Filed 2017·Granted Apr 23, 2019·0 cites·10 claims
- 0846US9691675B1Method for forming an electrical device and electrical devicesINTEL CORP·Filed 2015·Granted Jun 27, 2017·0 cites·15 claims
- 0929US2016268213A1On Package Floating Metal/Stiffener Grounding to Mitigate RFI and SI RisksINTEL CORP·Filed 2015·Application pending·0 cites
- 1027US2017287799A1Removable ic package stiffenerKLEIN STEVEN A·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →