Inventor · disambiguated record
Ashok N. Prabhu
Also filed as: PRABHU ASHOK N · PRABHU ASHOK NARAYAN
56 granted patents·1,750 citations·filing 1981–2002
99Inventor score
Top patents by PatentIndex Score
56 records- 0197US6455930B1Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technologyLAMINA CERAMICS INC·Filed 2000·Granted Sep 24, 2002·126 cites·8 claims
- 0293US6713862B2Low temperature co-fired ceramic-metal packaging technologyLAMINA CERAMICS·Filed 2002·Granted Mar 30, 2004·67 cites·10 claims
- 0393US5644327ATessellated electroluminescent display having a multilayer ceramic substrateSARNOFF DAVID RES CENTER·Filed 1995·Granted Jul 1, 1997·158 cites·15 claims
- 0489US5581876AMethod of adhering green tape to a metal support substrate with a bonding glassSARNOFF DAVID RES CENTER·Filed 1995·Granted Dec 10, 1996·104 cites·12 claims
- 0589US4880567AThick film copper conductor inksGEN ELECTRIC·Filed 1988·Granted Nov 14, 1989·45 cites·6 claims
- 0685US4415624AAir-fireable thick film inksRCA CORP·Filed 1983·Granted Nov 15, 1983·46 cites·24 claims
- 0783US6055151AMultilayer ceramic circuit boards including embedded componentsSARNOFF CORP·Filed 1998·Granted Apr 25, 2000·70 cites·25 claims
- 0883US5880705AMounting structure for a tessellated electronic display having a multilayer ceramic structure and tessellated electronic displaySARNOFF CORP·Filed 1997·Granted Mar 9, 1999·73 cites·23 claims
- 0981US6140759AEmbossed plasma display back panelSARNOFF CORP·Filed 1998·Granted Oct 31, 2000·35 cites·11 claims
- 1081US5847935AElectronic circuit chip packageSARNOFF CORP·Filed 1996·Granted Dec 8, 1998·63 cites·14 claims
- 1180US5216207ALow temperature co-fired multilayer ceramic circuit boards with silver conductorsSARNOFF DAVID RES CENTER·Filed 1991·Granted Jun 1, 1993·63 cites·18 claims
- 1279US6361390B1Method for making an embossed plasma display back panelSARNOFF CORP·Filed 2000·Granted Mar 26, 2002·18 cites·26 claims
- 1379US4369220ACrossover dielectric inks used in forming a multilayer electrical circuitRCA CORP·Filed 1982·Granted Jan 18, 1983·25 cites·8 claims
- 1478US6399230B1Multilayer ceramic circuit boards with embedded resistorsSARNOFF CORP·Filed 1999·Granted Jun 4, 2002·50 cites·9 claims
- 1577US6321569B1Method for forming back panel for a plasma display deviceSARNOFF CORP·Filed 2000·Granted Nov 27, 2001·14 cites·13 claims
- 1677US5953203AMultilayer ceramic circuit boards including embedded capacitorsSARNOFF CORP·Filed 1997·Granted Sep 14, 1999·50 cites·18 claims
- 1777US5858145AMethod to control cavity dimensions of fired multilayer circuit boards on a supportSARNOFF CORP·Filed 1996·Granted Jan 12, 1999·64 cites·11 claims
- 1877US5256469AMulti-layered, co-fired, ceramic-on-metal circuit board for microelectronic packagingGEN ELECTRIC·Filed 1991·Granted Oct 26, 1993·64 cites·16 claims
- 1976US5866240AThick ceramic on metal multilayer circuit boardSARNOFF CORP·Filed 1997·Granted Feb 2, 1999·48 cites·14 claims
- 2071US5958807ALow dielectric loss glass ceramic compositionsSARNOFF CORP·Filed 1997·Granted Sep 28, 1999·34 cites·4 claims
- 2171US4376725AConductor inksRCA CORP·Filed 1981·Granted Mar 15, 1983·21 cites·9 claims
- 2271US4369254ACrossover dielectric inksRCA CORP·Filed 1981·Granted Jan 18, 1983·18 cites·7 claims
- 2370US6017642ALow dielectric loss glassesSARNOFF CORP·Filed 1997·Granted Jan 25, 2000·32 cites·6 claims
- 2469US4830988ADielectric inks for multilayer copper circuitsGEN ELECTRIC·Filed 1987·Granted May 16, 1989·26 cites·10 claims
- 2569US4816615AThick film copper conductor inksGEN ELECTRIC·Filed 1987·Granted Mar 28, 1989·24 cites·5 claims
- 2668US6140767APlasma display having specific substrate and barrier ribsSARNOFF CORP·Filed 1998·Granted Oct 31, 2000·17 cites·5 claims
- 2768US6011330AMiniature power supplySARNOFF CORP·Filed 1997·Granted Jan 4, 2000·34 cites·13 claims
- 2868US4619836AMethod of fabricating thick film electrical componentsRCA CORP·Filed 1985·Granted Oct 28, 1986·25 cites·6 claims
- 2968US4479890AThick film resistor inksRCA CORP·Filed 1982·Granted Oct 30, 1984·15 cites·10 claims
- 3068US4401709AOverglaze inksRCA CORP·Filed 1982·Granted Aug 30, 1983·17 cites·7 claims
- 3165US4733018AThick film copper conductor inksRCA CORP·Filed 1986·Granted Mar 22, 1988·22 cites·6 claims
- 3263US5514451AConductive via fill inks for ceramic multilayer circuit boards on support substratesSARNOFF DAVID RES CENTER·Filed 1995·Granted May 7, 1996·29 cites·16 claims
- 3362US4377642AOverglaze inksRCA CORP·Filed 1981·Granted Mar 22, 1983·13 cites·6 claims
- 3461US4808673ADielectric inks for multilayer copper circuitsGEN ELECTRIC·Filed 1987·Granted Feb 28, 1989·17 cites·15 claims
- 3561US4788163ADevitrifying glass fritsGEN ELECTRIC·Filed 1987·Granted Nov 29, 1988·17 cites·8 claims
- 3661US4379195ALow value resistor inksRCA CORP·Filed 1981·Granted Apr 5, 1983·15 cites·10 claims
- 3760US4997795ADielectric compositions of devitrified glass containing small amounts of lead oxide and iron oxideGEN ELECTRIC·Filed 1989·Granted Mar 5, 1991·17 cites·17 claims
- 3855US5876536AMethod for the reduction of lateral shrinkage in multilayer circuit boards on a substrateSARNOFF CORP·Filed 1997·Granted Mar 2, 1999·20 cites·6 claims
- 3954US5035939AManufacture of printed circuit boardsSARNOFF DAVID RES CENTER·Filed 1990·Granted Jul 30, 1991·18 cites·17 claims
- 4053US4808770AThick-film copper conductor inksGEN ELECTRIC·Filed 1987·Granted Feb 28, 1989·13 cites·6 claims
- 4152US4399320AConductor inksRCA CORP·Filed 1982·Granted Aug 16, 1983·10 cites·5 claims
- 4251US4874550AThick-film copper conductor inksGEN ELECTRIC·Filed 1988·Granted Oct 17, 1989·13 cites·7 claims
- 4351US4810420AThick film copper via-fill inksGEN ELECTRIC·Filed 1986·Granted Mar 7, 1989·14 cites·9 claims
- 4449US4863517AVia fill ink composition for integrated circuitsGEN ELECTRIC·Filed 1988·Granted Sep 5, 1989·12 cites·6 claims
- 4547US4772574ACeramic filled glass dielectricsGEN ELECTRIC·Filed 1987·Granted Sep 20, 1988·8 cites·10 claims
- 4646US6191934B1High dielectric constant embedded capacitorsSARNOFF CORP & CO LTD·Filed 1998·Granted Feb 20, 2001·14 cites·19 claims
- 4743US6709749B1Method for the reduction of lateral shrinkage in multilayer circuit boards on a substrateLAMINA CERAMICS INC·Filed 1998·Granted Mar 23, 2004·10 cites·2 claims
- 4843US4380750AIndium oxide resistor inksRCA CORP·Filed 1981·Granted Apr 19, 1983·5 cites·10 claims
- 4942US6168490B1Back panel for a plasma display deviceSARNOFF CORP·Filed 1998·Granted Jan 2, 2001·9 cites·10 claims
- 5039US5124282AGlasses and overglaze inks made therefromSARNOFF DAVID RES CENTER·Filed 1990·Granted Jun 23, 1992·6 cites·9 claims
Showing the top 50 of 56 patent records by PatentIndex Score.
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