Inventor · disambiguated record
Astitva Tripathi
Also filed as: TRIPATHI ASTITVA
0 granted patents·7 pending applications·0 citations·filing 2023–2023
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0157US2025112174A1Annealed shape memory alloy on a substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 0255US2025113434A1Through glass via (tgv) with modulated profile for core stress reductionINTEL CORP·Filed 2023·Application pending·0 cites
- 0353US2025112136A1Glass core protection using peripheral buffer layersINTEL CORP·Filed 2023·Application pending·0 cites
- 0452US2025112163A1Through-glass via liners for integrated circuit device packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 0551US2025112175A1Microelectronic assemblies with edge stress reduction in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 0651US2025183182A1Microelectronic assemblies with through-glass via stress alleviation in glass coresSHAN BOHAN·Filed 2023·Application pending·0 cites
- 0750US2025112140A1Stress mitigation architectures for glass core substratesINTEL CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →