Inventor · disambiguated record
Atsushi Hino
Also filed as: HINO ATSUSHI
28 granted patents·6 pending applications·798 citations·filing 1988–2014
97Inventor score
Top patents by PatentIndex Score
34 records- 0193US5072289AWiring substrate, film carrier, semiconductor device made by using the film carrier, and mounting structure comprising the semiconductor deviceNITTO DENKO CORP·Filed 1989·Granted Dec 10, 1991·91 cites·16 claims
- 0292US7913734B2Method and system for laminating optical elementsNITTO DENKO CORP·Filed 2010·Granted Mar 29, 2011·11 cites·5 claims
- 0392US5977783AMultilayer probe for measuring electrical characteristicsNITTO DENKO CORP·Filed 1995·Granted Nov 2, 1999·115 cites·8 claims
- 0489US5374469AFlexible printed substrateNITTO DENKO CORP·Filed 1992·Granted Dec 20, 1994·116 cites·46 claims
- 0588US6373709B1Flexible wiring boardNITTO DENKO CORP·Filed 2000·Granted Apr 16, 2002·25 cites·3 claims
- 0683US5821626AFilm carrier, semiconductor device using same and method for mounting semiconductor elementNITTO DENKO CORP·Filed 1996·Granted Oct 13, 1998·71 cites·15 claims
- 0782US5877559AFilm carrier for fine-pitched and high density mounting and semiconductor device using sameNITTO DENKO CORP·Filed 1996·Granted Mar 2, 1999·71 cites·9 claims
- 0881US8168030B2Manufacturing method of laser processed parts and adhesive sheet for laser processingMATSUO NAOYUKI·Filed 2006·Granted May 1, 2012·7 cites·8 claims
- 0980US7922843B2Method and system for laminating optical elementsNITTO DENKO CORP·Filed 2009·Granted Apr 12, 2011·9 cites·14 claims
- 1079US8624156B2Manufacturing method of laser processed parts and protective sheet for laser processingMATSUO NAOYUKI·Filed 2006·Granted Jan 7, 2014·6 cites·31 claims
- 1179US6157084AFilm carrier and semiconductor device using sameNITTO DENKO CORP·Filed 1995·Granted Dec 5, 2000·45 cites·18 claims
- 1277US6037103AMethod for forming hole in printed boardNITTO DENKO CORP·Filed 1997·Granted Mar 14, 2000·32 cites·2 claims
- 1376US7586060B2Protective sheet for laser processing and manufacturing method of laser processed partsNITTO DENKO CORP·Filed 2004·Granted Sep 8, 2009·13 cites·16 claims
- 1471US7085469B2Process for producing three-dimensional polyimide optical waveguideNITTO DENKO CORP·Filed 2003·Granted Aug 1, 2006·15 cites·11 claims
- 1569US5136359AAnisotropic conductive film with through-holes filled with metallic materialNITTO DENKO CORP·Filed 1990·Granted Aug 4, 1992·30 cites·4 claims
- 1667US6222272B1Film carrier and semiconductor device using sameNITTO DENKO CORP·Filed 1998·Granted Apr 24, 2001·29 cites·14 claims
- 1765US6168910B1Method for removing residue and method for production of printed board having holeNITTO DENKO CORP·Filed 1999·Granted Jan 2, 2001·20 cites·5 claims
- 1864US6642478B2Method for forming a via hole, flexible wiring board using the method, and method for producing the flexible wiring boardNITTO DENKO CORP·Filed 2002·Granted Nov 4, 2003·2 cites·7 claims
- 1964US5848465AMethod for fabrication of probeNITTO DENKO CORP·Filed 1996·Granted Dec 15, 1998·25 cites·8 claims
- 2060US4916009AFlexible printing baseNITTO ELECTRIC IND CO·Filed 1988·Granted Apr 10, 1990·25 cites·6 claims
- 2160US2009191410A1Resin joined bodyNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 2259US8778118B2Manufacturing method of laser processed parts, and pressure-sensitive adhesive sheet for laser processing used for the sameURAIRI MASAKATSU·Filed 2010·Granted Jul 15, 2014·1 cites·8 claims
- 2358US4955900AIntra-ocular lensNITTO DENKO CORP·Filed 1989·Granted Sep 11, 1990·10 cites·4 claims
- 2457US8846197B2Impact-absorbing pressure-sensitive adhesive sheet and method of producing the sameNOGUCHI TOMONORI·Filed 2007·Granted Sep 30, 2014·0 cites·7 claims
- 2556US5188702AProcess for producing an anisotropic conductive filmNITTO DENKO CORP·Filed 1992·Granted Feb 23, 1993·19 cites·2 claims
- 2654US9657198B2Impact-absorbing pressure-sensitive adhesive sheet and method of producing the sameNITTO DENKO CORP·Filed 2014·Granted May 23, 2017·0 cites·7 claims
- 2754US2009174119A1Method of manufacturing patterned resin sheetNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 2850US2010028606A1Optical film cutting method and optical filmNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2947US7858543B2Resin joined bodyNITTO DENKO CORP·Filed 2007·Granted Dec 28, 2010·0 cites·5 claims
- 3047US2006246279A1Method of producing laser-processed product and adhesive sheet, for laser processing used thereforURAIRI MASAKATSU·Filed 2004·Application pending·0 cites
- 3145US9566663B2Laser processing method and land laser processed productNISHIDA KANJI·Filed 2008·Granted Feb 14, 2017·0 cites·1 claims
- 3243US2010116800A1Optical film cutting method and optical filmNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 3342US5691210AMethod for fabrication of probe structure and circuit substrate thereforNITTO DENKO CORP·Filed 1996·Granted Nov 25, 1997·10 cites·11 claims
- 3441US2008061028A1Method for producing optical member and method for producing molding die for optical memberNITTO DENKO CORP·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →