Inventor · disambiguated record
Atsushi Hosogane
Also filed as: HOSOGANE ATSUSHI
13 granted patents·276 citations·filing 1991–2003
93Inventor score
Top patents by PatentIndex Score
13 records- 0196US5276573ASlider unit controllably actuated at a surface of a moving information recording mediumHITACHI LTD·Filed 1991·Granted Jan 4, 1994·99 cites·21 claims
- 0289US6507204B1Semiconductor testing equipment with probe formed on a cantilever of a substrateHITACHI LTD·Filed 2000·Granted Jan 14, 2003·40 cites·14 claims
- 0386US6358762B1Manufacture method for semiconductor inspection apparatusHITACHI LTD·Filed 2000·Granted Mar 19, 2002·38 cites·16 claims
- 0477US6531327B2Method for manufacturing semiconductor device utilizing semiconductor testing equipmentHITACHI LTD·Filed 2002·Granted Mar 11, 2003·17 cites·21 claims
- 0568US6864568B2Packaging device for holding a plurality of semiconductor devices to be inspectedRENESAS TECH CORP·Filed 2002·Granted Mar 8, 2005·10 cites·16 claims
- 0662US6548315B2Manufacture method for semiconductor inspection apparatusHITACHI LTD·Filed 2002·Granted Apr 15, 2003·8 cites·7 claims
- 0761US6714030B2Semiconductor inspection apparatusHITACHI LTD·Filed 2003·Granted Mar 30, 2004·7 cites·5 claims
- 0860US6573112B2Semiconductor device manufacturing methodHITACHI LTD·Filed 2002·Granted Jun 3, 2003·6 cites·10 claims
- 0959US6566149B1Method for manufacturing substrate for inspecting semiconductor deviceHITACHI LTD·Filed 1998·Granted May 20, 2003·22 cites·14 claims
- 1055US6465264B1Method for producing semiconductor device and apparatus usable thereinHITACHI LTD·Filed 2000·Granted Oct 15, 2002·4 cites·15 claims
- 1154US6511857B1Process for manufacturing semiconductor deviceHITACHI LTD·Filed 1999·Granted Jan 28, 2003·15 cites·18 claims
- 1245US6479305B2Semiconductor device manufacturing methodHITACHI LTD·Filed 1999·Granted Nov 12, 2002·10 cites·13 claims
- 1339US7119362B2Method of manufacturing semiconductor apparatusRENESAS TECH CORP·Filed 2002·Granted Oct 10, 2006·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →