Inventor · disambiguated record
Atsushi Komura
Also filed as: KOMURA ATSUSHI
19 granted patents·4 pending applications·312 citations·filing 1989–2021
94Inventor score
Top patents by PatentIndex Score
23 records- 0190US7838331B2Method for dicing semiconductor substrateDENSO CORP·Filed 2006·Granted Nov 23, 2010·16 cites·14 claims
- 0289US7901967B2Dicing method for semiconductor substrateDENSO CORP·Filed 2006·Granted Mar 8, 2011·20 cites·21 claims
- 0387US8446003B2Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrateKOMURA ATSUSHI·Filed 2010·Granted May 21, 2013·14 cites·19 claims
- 0481US5423941ADry etching process for semiconductorNIPPON DENSO CO·Filed 1993·Granted Jun 13, 1995·86 cites·7 claims
- 0580US7642653B2Semiconductor device, wiring of semiconductor device, and method of forming wiringDENSO CORP·Filed 2007·Granted Jan 5, 2010·13 cites·22 claims
- 0678US11365154B2Silicon nitride-based sintered body and cutting insertNGK SPARK PLUG CO·Filed 2017·Granted Jun 21, 2022·1 cites·15 claims
- 0777US8007561B2Cermet insert and cutting toolNGK SPARK PLUG CO·Filed 2006·Granted Aug 30, 2011·3 cites·6 claims
- 0877US5480832AMethod for fabrication of semiconductor deviceNIPPON DENSO CO·Filed 1992·Granted Jan 2, 1996·57 cites·26 claims
- 0974US7762747B2Cermet insert and cutting toolMITSUBISHI MATERIALS CORP·Filed 2006·Granted Jul 27, 2010·2 cites·12 claims
- 1065US6348735B1Electrode for semiconductor device and method for manufacturing sameNIPPONDENSO CO LT·Filed 2000·Granted Feb 19, 2002·13 cites·24 claims
- 1164US6066891AElectrode for semiconductor device including an alloy wiring layer for reducing defects in an aluminum layer and method for manufacturing the sameNIPPON DENSO CO·Filed 1997·Granted May 23, 2000·21 cites·26 claims
- 1264US5522966ADry etching process for semiconductorNIPPON DENSO CO·Filed 1993·Granted Jun 4, 1996·38 cites·5 claims
- 1364US2021155550A1Silicon nitride-based sintered body and cutting insertNGK SPARK PLUG CO·Filed 2021·Application pending·0 cites
- 1452US9739927B2Light source device and display apparatusSAKAI DISPLAY PRODUCTS CORP·Filed 2014·Granted Aug 22, 2017·0 cites·5 claims
- 1551US11173555B2Surface-coated cutting toolNGK SPARK PLUG CO·Filed 2018·Granted Nov 16, 2021·0 cites·3 claims
- 1647US6885466B1Method for measuring thickness of oxide filmDENSO CORP·Filed 2000·Granted Apr 26, 2005·3 cites·18 claims
- 1746US5018001AAluminum line with crystal grainsNIPPON DENSO CO·Filed 1989·Granted May 21, 1991·13 cites·17 claims
- 1845US6268298B1Method of manufacturing semiconductor deviceDENSO CORP·Filed 1999·Granted Jul 31, 2001·12 cites·6 claims
- 1943US10058925B2Sialon sintered body and cutting insertNGK SPARK PLUG CO·Filed 2015·Granted Aug 28, 2018·0 cites·6 claims
- 2043US2007111484A1Dicing sheet frameDENSO CORP·Filed 2006·Application pending·0 cites
- 2142US2008258304A1Semiconductor device having multiple wiring layersDENSO CORP·Filed 2008·Application pending·0 cites
- 2241US2008119349A1Sialon Insert and Cutting Tool Equipped TherewithNGK SPARK PLUG CO·Filed 2005·Application pending·0 cites
- 2336US9196288B2Process and apparatus for producing optical recording mediumFUROMOTO SHIGEYUKI·Filed 2007·Granted Nov 24, 2015·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →