Inventor · disambiguated record
Athens Okoren
Also filed as: OKOREN ATHENS
5 granted patents·3 pending applications·0 citations·filing 2018–2025
63Inventor score
Top patents by PatentIndex Score
8 records- 0172US2025343062A1Rigid carrier assemblies with tacky media molded thereonDAEWON SEMICONDUCTOR PACKAGING IND COMPANY·Filed 2025·Application pending·0 cites
- 0271US2024429080A1Separators for handling, transporting, or storing semiconductor wafersDAEWON SEMICONDUCTOR PACKAGING IND COMPANY·Filed 2024·Application pending·0 cites
- 0366US12106988B2Separators for handling, transporting, or storing semiconductor wafersDAEWON SEMICONDUCTOR PACKAGING IND COMPANY·Filed 2022·Granted Oct 1, 2024·0 cites·15 claims
- 0465US12387957B2Rigid carrier assemblies with tacky media molded thereonDAEWON SEMICONDUCTOR PACKAGING IND COMPANY·Filed 2022·Granted Aug 12, 2025·0 cites·15 claims
- 0565US11764133B2Tape carrier assemblies having an integrated adhesive filmDAEWON SEMICONDUCTOR PACKAGING IND COMPANY·Filed 2022·Granted Sep 19, 2023·0 cites·16 claims
- 0654US11257700B2Separators for handling, transporting, or storing semiconductor wafersDAEWON SEMICONDUCTOR PACKAGING IND COMPANY·Filed 2018·Granted Feb 22, 2022·0 cites·19 claims
- 0750US11362025B2Tape carrier assemblies having an integrated adhesive filmDAEWON SEMICONDUCTOR PACKAGING IND COMPANY·Filed 2018·Granted Jun 14, 2022·0 cites·12 claims
- 0836US2019067061A1Rigid carrier assemblies having an integrated adhesive filmDAEWON SEMICONDUCTOR PACKAGING IND COMPANY·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →