Inventor · disambiguated record
Atsushi Saiki
Also filed as: HARADA SEIKI · SAIKI ATSUSHI
15 granted patents·2 pending applications·373 citations·filing 1973–2015
94Inventor score
Files withHITACHI LTD10MITSUBISHI RAYON CO3HITACHI CHEMICAL CO LTD1HITACHI PLANT ENG & CONSTR CO1MITSUBISHI CHEM CORP1
Top patents by PatentIndex Score
17 records- 0193US4001870AIsolating protective film for semiconductor devices and method for making the sameHITACHI LTD·Filed 1973·Granted Jan 4, 1977·73 cites·20 claims
- 0291US4040083AAluminum oxide layer bonding polymer resin layer to semiconductor deviceHITACHI LTD·Filed 1974·Granted Aug 2, 1977·45 cites·44 claims
- 0388US4539616AThin film magnetic head and fabricating method thereofHITACHI LTD·Filed 1982·Granted Sep 3, 1985·31 cites·13 claims
- 0482US4693173AClean roomHITACHI PLANT ENG & CONSTR CO·Filed 1985·Granted Sep 15, 1987·37 cites·15 claims
- 0582US4017886ADiscrete semiconductor device having polymer resin as insulator and method for making the sameHITACHI LTD·Filed 1975·Granted Apr 12, 1977·52 cites·42 claims
- 0676US10551658B2Image display apparatus with touch panelMITSUBISHI CHEM CORP·Filed 2015·Granted Feb 4, 2020·1 cites·14 claims
- 0771US4436583ASelective etching method of polyimide type resin filmHITACHI LTD·Filed 1982·Granted Mar 13, 1984·32 cites·8 claims
- 0863US4218283AMethod for fabricating semiconductor device and etchant for polymer resinHITACHI LTD·Filed 1978·Granted Aug 19, 1980·20 cites·49 claims
- 0960US7766532B2Light guide for surface light source device and surface light source deviceMITSUBISHI RAYON CO·Filed 2006·Granted Aug 3, 2010·3 cites·13 claims
- 1060US4225702AMethod of preparing polyamide acid type intermediates for processing of semiconductorsHITACHI CHEMICAL CO LTD·Filed 1979·Granted Sep 30, 1980·12 cites·2 claims
- 1158US4113550AMethod for fabricating semiconductor device and etchant for polymer resinHITACHI LTD·Filed 1976·Granted Sep 12, 1978·17 cites·73 claims
- 1256US2016221315A1Laminate film and manufacturing method thereof, touch panel device, image display device, and mobile deviceMITSUBISHI RAYON CO·Filed 2014·Application pending·0 cites
- 1355US8022305B2Semiconductor device with a wiring board having an angled linear partPANASONIC CORP·Filed 2009·Granted Sep 20, 2011·0 cites·4 claims
- 1454US5391915AIntegrated circuit having reduced soft errors and reduced penetration of alkali impurities into the substrateHITACHI LTD·Filed 1993·Granted Feb 21, 1995·22 cites·7 claims
- 1551US4926238ASemiconductor device and method for producing the sameHITACHI LTD·Filed 1988·Granted May 15, 1990·17 cites·25 claims
- 1651US2015060289A1Stamper, method of manufacturing the same, and method of manufacturing molded bodyMITSUBISHI RAYON CO·Filed 2012·Application pending·0 cites
- 1741US6747339B1Integrated circuit having reduced soft errors and reduced penetration of alkali impurities into the substrateHITACHI LTD·Filed 1994·Granted Jun 8, 2004·11 cites·63 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →