Inventor · disambiguated record
Au Seong Wong
Also filed as: WONG AU SEONG
1 granted patent·1 pending application·0 citations·filing 2010–2018
13Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0142US10879219B2Lower IC package structure for coupling with an upper IC package to form a package-on-package (PoP) assembly and PoP assembly including such a lower IC package structureINTEL CORP·Filed 2018·Granted Dec 29, 2020·0 cites·19 claims
- 0230US2012159118A1Lower IC Package Structure for Coupling with an Upper IC Package to Form a Package-On-Package (PoP) Assembly and PoP Assembly Including Such a Lower IC Package StructureWONG SHAW FONG·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →