Inventor · disambiguated record
Axel Grosse
Also filed as: GROSSE AXEL
8 granted patents·2 pending applications·9 citations·filing 2006–2017
78Inventor score
Top patents by PatentIndex Score
10 records- 0172US10927004B2Method for bonding wafers eutectically, and a wafer compositeBOSCH GMBH ROBERT·Filed 2017·Granted Feb 23, 2021·1 cites·7 claims
- 0265US8304845B2Method for sealing an openingBISCHOF UDO·Filed 2006·Granted Nov 6, 2012·4 cites·16 claims
- 0361US8402827B2Sensor element and method for operating a sensor elementSTAHL HEIKO·Filed 2010·Granted Mar 26, 2013·1 cites·13 claims
- 0458US9042581B2Component having a micromechanical microphone structure, and method for manufacturing sameZOELLIN JOCHEN·Filed 2010·Granted May 26, 2015·1 cites·8 claims
- 0554US8154094B2Micromechanical component having a cap having a closureSCHMITZ VOLKER·Filed 2006·Granted Apr 10, 2012·2 cites·7 claims
- 0652US9114975B2Micromechanical component and method for producing a micromechanical component having a thin-layer capSCHMITZ VOLKER·Filed 2014·Granted Aug 25, 2015·0 cites·7 claims
- 0744US8809095B2Micromechanical component and method for producing a micromechanical component having a thin-layer capSCHMITZ VOLKER·Filed 2008·Granted Aug 19, 2014·0 cites·14 claims
- 0835US2009168836A1Micromechanical structure having a substrate and a thermoelement, temperature sensor and/or radiation sensor, and method for manufacturing a micromechanical structureHOEFER HOLGER·Filed 2006·Application pending·0 cites
- 0933US8530260B2Method for attaching a first carrier device to a second carrier device and micromechanical componentsGONSKA JULIAN·Filed 2010·Granted Sep 10, 2013·0 cites·9 claims
- 1031US2015232331A1Layer structure for a micromechanical componentBOSCH GMBH ROBERT·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →