Inventor · disambiguated record
Ayako Taira
Also filed as: TAIRA AYAKO
2 granted patents·2 pending applications·2 citations·filing 2005–2023
35Inventor score
Top patents by PatentIndex Score
4 records- 0168US2025282945A1Curable resin composition and electronic component deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 0258US8421247B2Connecting material having metallic particles of an oxygen state ratio and size and semiconductor device having the connecting materialHAYASHI HIROKI·Filed 2009·Granted Apr 16, 2013·2 cites·12 claims
- 0339US12482707B2Method of manufacturing semiconductor device and colletRESONAC CORP·Filed 2020·Granted Nov 25, 2025·0 cites·15 claims
- 0432US2008261049A1Electroconductive Paste and Substrate Using the Same for Mounting Electronic PartsHAYASHI HIROKI·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →