Inventor · disambiguated record
Ayumi Takahashi
Also filed as: TAKAHASHI AYUMI
9 granted patents·3 pending applications·6 citations·filing 2001–2023
76Inventor score
Top patents by PatentIndex Score
12 records- 0167US9765173B2Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit boardDAINIPPON INK & CHEMICALS·Filed 2014·Granted Sep 19, 2017·2 cites·8 claims
- 0257US2025313959A1Rust preventative for hypochlorous acid aqueous solution, fungicide and method for preparing sameTOKUYAMA DENTAL CORP·Filed 2023·Application pending·0 cites
- 0350US9890237B2Epoxy compound, epoxy resin, curable compound, cured product thereof, semiconductor sealing material, and printed circuit boardDAINIPPON INK & CHEMICALS·Filed 2014·Granted Feb 13, 2018·0 cites·8 claims
- 0450US6739762B2Optical device packageJAPAN AVIATION ELECTRON·Filed 2001·Granted May 25, 2004·4 cites·6 claims
- 0546US11091714B2Fuel oil “A” compositionSHELL OIL CO·Filed 2016·Granted Aug 17, 2021·0 cites·11 claims
- 0645US2024102175A1Corrosion inhibitor for hypochlorous acid aqueous solution, bactericidal detergent having corrosion inhibiting effect, and preparation method thereforTOKUYAMA DENTAL CORP·Filed 2022·Application pending·0 cites
- 0743US10081585B2Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit boardDAINIPPON INK & CHEMICALS·Filed 2014·Granted Sep 25, 2018·0 cites·6 claims
- 0843US10011676B2Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit boardDAINIPPON INK & CHEMICALS·Filed 2014·Granted Jul 3, 2018·0 cites·5 claims
- 0942US10435382B2Epoxy compound, epoxy resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit boardDAINIPPON INK & CHEMICALS·Filed 2014·Granted Oct 8, 2019·0 cites·7 claims
- 1039US12195332B2Method for producing weakly acidic hypochlorous acid aqueous solutionTOKUYAMA DENTAL CORP·Filed 2019·Granted Jan 14, 2025·0 cites·7 claims
- 1137US9902798B2Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit boardDAINIPPON INK & CHEMICALS·Filed 2014·Granted Feb 27, 2018·0 cites·6 claims
- 1233US2018346639A1Epoxy resin, method for producing the epoxy resin, curable resin composition, and cured product thereofDAINIPPON INK & CHEMICALS·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →