Inventor · disambiguated record
Barry A. Bonitz
Also filed as: BONITZ BARRY A
4 granted patents·1 pending application·40 citations·filing 1993–2010
76Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0159US6545869B2Adjusting fillet geometry to couple a heat spreader to a chip carrierIBM·Filed 2001·Granted Apr 8, 2003·8 cites·19 claims
- 0255US6984286B2Adjusting fillet geometry to couple a heat spreader to a chip carrierIBM·Filed 2003·Granted Jan 10, 2006·6 cites·27 claims
- 0352US7094966B2Packaging integrated circuits with adhesive postsIBM·Filed 2002·Granted Aug 22, 2006·5 cites·15 claims
- 0448US5414928AMethod of making an electronic package assembly with protective encapsulant materialIBM·Filed 1993·Granted May 16, 1995·21 cites·9 claims
- 0534US2012243147A1Land grid array (lga) contact connector modificationMARCONI FRANCESCO F·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Barry A. Bonitz files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →