Inventor · disambiguated record
Barbara Eichinger
Also filed as: EICHINGER BARBARA
7 granted patents·8 citations·filing 2015–2021
74Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG7
Top patents by PatentIndex Score
7 records- 0184US9929111B2Method of manufacturing a layer structure having partially sealed poresINFINEON TECHNOLOGIES AG·Filed 2017·Granted Mar 27, 2018·4 cites·20 claims
- 0283US9620466B1Method of manufacturing an electronic device having a contact pad with partially sealed poresINFINEON TECHNOLOGIES AG·Filed 2015·Granted Apr 11, 2017·4 cites·18 claims
- 0356US11552048B2Semiconductor device including an electrical contact with a metal layer arranged thereonINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jan 10, 2023·0 cites·17 claims
- 0451US11488921B2Multi-chip device, method of manufacturing a multi-chip device, and method of forming a metal interconnectINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 1, 2022·0 cites·26 claims
- 0550US11756923B2High density and durable semiconductor device interconnectINFINEON TECHNOLOGIES AG·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 0646US11329021B2Method for fabricating a semiconductor device comprising a paste layer and semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 10, 2022·0 cites·16 claims
- 0743US10199372B2Monolithically integrated chip including active electrical components and passive electrical components with chip edge stabilization structuresINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 5, 2019·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →