Inventor · disambiguated record
Bamidele Daniel Falola
Also filed as: FALOLA BAMIDELE DANIEL
5 granted patents·2 citations·filing 2019–2021
63Inventor score
Technology areasH10W
Files withINTEL CORP5
Top patents by PatentIndex Score
5 records- 0165US12166004B2Solder thermal interface material (STIM) with dopantINTEL CORP·Filed 2019·Granted Dec 10, 2024·1 cites·20 claims
- 0265US11670569B2Channeled lids for integrated circuit packagesINTEL CORP·Filed 2019·Granted Jun 6, 2023·1 cites·22 claims
- 0351US11798861B2Integrated heat spreader (IHS) with heating elementINTEL CORP·Filed 2019·Granted Oct 24, 2023·0 cites·20 claims
- 0449US12183688B2Integrated circuit die package stiffeners of metal alloys having exceptionally high CTEINTEL CORP·Filed 2021·Granted Dec 31, 2024·0 cites·21 claims
- 0547US11817369B2Lids for integrated circuit packages with solder thermal interface materialsINTEL CORP·Filed 2019·Granted Nov 14, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →