Inventor · disambiguated record
Balaram Ghosal
Also filed as: GHOSAL BALARAM
9 granted patents·1 pending application·120 citations·filing 1993–2011
89Inventor score
Top patents by PatentIndex Score
10 records- 0179US6998327B2Thin film transfer join process and multilevel thin film moduleIBM·Filed 2002·Granted Feb 14, 2006·27 cites·12 claims
- 0274US8026613B2Interconnections for flip-chip using lead-free solders and having reaction barrier layersIBM·Filed 2008·Granted Sep 27, 2011·4 cites·6 claims
- 0374US7410833B2Interconnections for flip-chip using lead-free solders and having reaction barrier layersIBM·Filed 2004·Granted Aug 12, 2008·14 cites·18 claims
- 0471US7923849B2Interconnections for flip-chip using lead-free solders and having reaction barrier layersIBM·Filed 2008·Granted Apr 12, 2011·3 cites·9 claims
- 0561US5448016ASelectively coated member having a shank with a portion maskedIBM·Filed 1994·Granted Sep 5, 1995·26 cites·19 claims
- 0652US5868304ASocketable bump grid array shaped-solder on copper spheresIBM·Filed 1996·Granted Feb 9, 1999·19 cites·9 claims
- 0750US2012012642A1Interconnections for flip-chip using lead-free solders and having reaction barrier layersFOGEL KEITH E·Filed 2011·Application pending·0 cites
- 0843US5670418AMethod of joining an electrical contact element to a substrateIBM·Filed 1996·Granted Sep 23, 1997·12 cites·8 claims
- 0943US5397598AMethod for selectively coating a member having a shank by masking a portion of the shank with a washerIBM·Filed 1993·Granted Mar 14, 1995·12 cites·12 claims
- 1032US6070782ASocketable bump grid array shaped-solder on copper spheresIBM·Filed 1998·Granted Jun 6, 2000·3 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →