Inventor · disambiguated record
Bang-Ning Hsu
Also filed as: HSU BANG-NING
4 granted patents·4 pending applications·0 citations·filing 2020–2024
53Inventor score
Files withMICRON TECHNOLOGY INC8
Top patents by PatentIndex Score
8 records- 0167US12451455B2Systems and methods for direct bonding in semiconductor die manufacturingMICRON TECHNOLOGY INC·Filed 2022·Granted Oct 21, 2025·0 cites·16 claims
- 0260US2024421040A1Apparatus including tsv structureMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0359US12506118B2Perpendicular semiconductor device assemblies and associated methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
- 0459US12368131B2Embedded nanoparticles for on-die thermal enhancement of hybrid bonding and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 0555US2024071969A1Semiconductor die stacks and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 0651US2024071972A1Semiconductor conductive pillar device and methodMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 0746US11764164B2Semiconductor device and method of forming the sameMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 19, 2023·0 cites·14 claims
- 0845US2023060671A1On-die temperature control for semiconductor die assemblies and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →