Inventor · disambiguated record
Bai-Xuan Jiang
Also filed as: JIANG BAI-XUAN
3 granted patents·3 pending applications·2 citations·filing 2019–2023
50Inventor score
Files withHONG CHUANG APPLIED TECH CO LTD6
Top patents by PatentIndex Score
6 records- 0173US11462430B2Ceramic-circuit composite structure and method for making the sameHONG CHUANG APPLIED TECH CO LTD·Filed 2019·Granted Oct 4, 2022·2 cites·12 claims
- 0253US12159855B2Silicon carbide composite wafer and manufacturing method thereofHONG CHUANG APPLIED TECH CO LTD·Filed 2021·Granted Dec 3, 2024·0 cites·7 claims
- 0352US2024246258A1Ceramic wafer and manufacturing method thereofHONG CHUANG APPLIED TECH CO LTD·Filed 2023·Application pending·0 cites
- 0450US2024063050A1Ceramic wafer with surface shape and manufacturing thereofHONG CHUANG APPLIED TECH CO LTD·Filed 2022·Application pending·0 cites
- 0549US11355448B2Method for making aluminum nitride wafer and aluminum nitride wafer made by the sameHONG CHUANG APPLIED TECH CO LTD·Filed 2020·Granted Jun 7, 2022·0 cites·17 claims
- 0647US2023278315A1Composite substrate and manufacturing method thereofHONG CHUANG APPLIED TECH CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →