Inventor · disambiguated record
Baikwoo Lee
Also filed as: LEE BAIKWOO
3 granted patents·2 citations·filing 2015–2017
50Inventor score
Top patents by PatentIndex Score
3 records- 0166US9601466B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 21, 2017·2 cites·15 claims
- 0246US10510628B2Contact pads for electrical module assembly with multidimensional transducer arraysSIEMENS MEDICAL SOLUTIONS USA INC·Filed 2017·Granted Dec 17, 2019·0 cites·16 claims
- 0345US9818703B2Printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 14, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →