Inventor · disambiguated record
Barry A. Lee
Also filed as: LEE BARRY A · LEE BARRY ANDREW
9 granted patents·1 pending application·120 citations·filing 2000–2014
88Inventor score
Top patents by PatentIndex Score
10 records- 0191US8786158B2Continuously formed annular laminated article and method for its manufactureNEUENSCHWANDER THOMAS R·Filed 2011·Granted Jul 22, 2014·14 cites·20 claims
- 0290US9685264B2Die assembly and method for manufacturing wound motor laminated articleL H CARBIDE CORP·Filed 2013·Granted Jun 20, 2017·8 cites·17 claims
- 0388US6742239B2Progressive stamping die assembly having transversely movable die station and method of manufacturing a stack of laminae therewithL H CARBIDE CORP·Filed 2002·Granted Jun 1, 2004·43 cites·8 claims
- 0485US9099897B2Method for connecting end sections of an annular laminated article and articles made therefromNEUENSCHWANDER THOMAS R·Filed 2012·Granted Aug 4, 2015·10 cites·24 claims
- 0580US6484387B1Progressive stamping die assembly having transversely movable die station and method of manufacturing a stack of laminae therewithL H CARBIDE CORP·Filed 2000·Granted Nov 26, 2002·27 cites·19 claims
- 0678US7600312B2Die assembly for manufacturing lamina stacks that include formed featuresL H CARBIDE CORP·Filed 2005·Granted Oct 13, 2009·9 cites·14 claims
- 0765US7337531B2Die assembly and method for manufacturing lamina stacks from a plurality of separate strips of stock materialL H CARBIDE CORP·Filed 2004·Granted Mar 4, 2008·7 cites·30 claims
- 0862US7676906B2Method for manufacturing lamina stacks from a plurality of separate strips of stock materialL H CARBIDE CORP·Filed 2007·Granted Mar 16, 2010·2 cites·20 claims
- 0958US9479034B2Continuously formed annular laminated article and method for its manufactureL H CARBIDE CORP·Filed 2014·Granted Oct 25, 2016·0 cites·8 claims
- 1057US2014139067A1Die assembly and method for manufacturing wound motor laminated articleL H CARBIDE CORP·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →