Inventor · disambiguated record
Barry Jia-Fu Lin
Also filed as: LIN BARRY · LIN BARRY JIA-FU
10 granted patents·5 pending applications·52 citations·filing 1996–2025
86Inventor score
Top patents by PatentIndex Score
15 records- 0177US8718720B1Die including a groove extending from a via to an edge of the dieLIU SHIXI LOUIS·Filed 2010·Granted May 6, 2014·5 cites·14 claims
- 0273US8487705B2Protection circuit for radio frequency power amplifierYAO JINGSHI·Filed 2011·Granted Jul 16, 2013·9 cites·20 claims
- 0367US9929702B2Linearization circuit for a multiple-stage RF power amplifierQORVO US INC·Filed 2016·Granted Mar 27, 2018·2 cites·15 claims
- 0465US8164389B2Overdrive protection circuitSUN XIAOPENG·Filed 2010·Granted Apr 24, 2012·4 cites·22 claims
- 0564US12224232B2Semiconductor package having side wall platingSILICONIX INCORPORATED·Filed 2019·Granted Feb 11, 2025·1 cites·19 claims
- 0661US7012288B2Heterojunction bipolar transistor having non-uniformly doped collector for improved safe-operating areaWJ COMMUNICATIONS INC·Filed 2002·Granted Mar 14, 2006·10 cites·4 claims
- 0758US5850171AProcess for manufacturing resistor-networks with higher circuit density, smaller input/output pitches, and lower precision toleranceCYNTEC COMPANY·Filed 1996·Granted Dec 15, 1998·21 cites·11 claims
- 0857US2025300610A1Low Noise Amplifier Circuit Capable of Enhancing Operational Linearity and Noise Reduction PerformanceWAVETEK MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0956US2025046685A1Method for forming a semiconductor device, and a structure formed by the methodSILICONIX INCORPORATED·Filed 2023·Application pending·0 cites
- 1052US9190384B2Preform including a groove extending to an edge of the preformTRIQUINT SEMICONDUCTOR INC·Filed 2014·Granted Nov 17, 2015·0 cites·12 claims
- 1152US2025359124A1Antenna tuning switch structureWAVETEK MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 1245US2025062196A1Semiconductor device and method of forming components for semiconductor deviceVISHAY SILLCONIX LLC·Filed 2021·Application pending·0 cites
- 1341US12211704B2Semiconductor package having side wall platingSILICONIX INCORPORATED·Filed 2019·Granted Jan 28, 2025·0 cites·13 claims
- 1433US2004188712A1Heterojunction bipolar transistor having non-uniformly doped collector for improved safe-operating areaEIC CORP·Filed 2004·Application pending·0 cites
- 1531US8648458B2Leadframe circuit and method thereforLIN BARRY·Filed 2010·Granted Feb 11, 2014·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →