Inventor · disambiguated record

Baichuan Liu

Also filed as: LIU BAICHUAN

1 granted patent·0 citations·filing 2023–2023

10Inventor score

Technology areasB21C

Files withSHANGHAI WONSUNG ALLOY MAT CO LTD1

Top patents by PatentIndex Score

1 record

0159US12024788B1Bonding copper wire plated with palladium and gold and electroplating process thereofSHANGHAI WONSUNG ALLOY MAT CO LTD·Filed 2023·Granted Jul 2, 2024·0 cites·8 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →