Inventor · disambiguated record
Barbara Luther
Also filed as: LUTHER BARBARA · LUTHER BARBARA J · LUTHER BARBARA JEAN
8 granted patents·778 citations·filing 1985–2001
91Inventor score
Files withIBM8
Top patents by PatentIndex Score
8 records- 0197US4789648AMethod for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud viasIBM·Filed 1985·Granted Dec 6, 1988·526 cites·6 claims
- 0288US6255217B1Plasma treatment to enhance inorganic dielectric adhesion to copperIBM·Filed 1999·Granted Jul 3, 2001·78 cites·18 claims
- 0380US6143640AMethod of fabricating a stacked via in copper/polyimide beolIBM·Filed 1997·Granted Nov 7, 2000·55 cites·25 claims
- 0475US6261951B1Plasma treatment to enhance inorganic dielectric adhesion to copperIBM·Filed 1999·Granted Jul 17, 2001·34 cites·19 claims
- 0572US6593660B2Plasma treatment to enhance inorganic dielectric adhesion to copperIBM·Filed 2001·Granted Jul 15, 2003·11 cites·12 claims
- 0671US6590290B1Stacked via in copper/polyimide BEOLIBM·Filed 2000·Granted Jul 8, 2003·16 cites·9 claims
- 0770US5854141AInorganic seal for encapsulation of an organic layer and method for making the sameIBM·Filed 1997·Granted Dec 29, 1998·32 cites·9 claims
- 0865US5861658AInorganic seal for encapsulation of an organic layer and method for making the sameIBM·Filed 1996·Granted Jan 19, 1999·26 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →