Inventor · disambiguated record
Basil Milton
Also filed as: MILTON BASIL
6 granted patents·5 pending applications·3 citations·filing 2017–2025
72Inventor score
Files withKULICKE & SOFFA IND INC11
Top patents by PatentIndex Score
11 records- 0183US12183711B2Methods of determining a sequence for creating a plurality of wire loops in connection with a workpieceKULICKE & SOFFA IND INC·Filed 2023·Granted Dec 31, 2024·1 cites·28 claims
- 0273US12300663B2Methods of forming wire interconnect structures and related wire bonding toolsKULICKE & SOFFA IND INC·Filed 2024·Granted May 13, 2025·0 cites·3 claims
- 0371US10672735B2Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loopsKULICKE & SOFFA IND INC·Filed 2019·Granted Jun 2, 2020·1 cites·27 claims
- 0468US2025079396A1Methods of determining a sequence for creating a plurality of wire loops in connection with a workpieceKULICKE & SOFFA IND INC·Filed 2024·Application pending·0 cites
- 0567US10325878B2Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loopsKULICKE & SOFFA IND INC·Filed 2017·Granted Jun 18, 2019·1 cites·21 claims
- 0666US2025239567A1Methods of forming wire interconnect structures and related wire bonding toolsKULICKE & SOFFA IND INC·Filed 2025·Application pending·0 cites
- 0764US11289448B2Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loopsKULICKE & SOFFA IND INC·Filed 2020·Granted Mar 29, 2022·0 cites·23 claims
- 0862US12057431B2Methods of forming wire interconnect structures and related wire bonding toolsKULICKE & SOFFA IND INC·Filed 2021·Granted Aug 6, 2024·0 cites·15 claims
- 0949US2023325552A1Methods of determining suitability of a wire bonding tool for a wire bonding application, and related methodsKULICKE & SOFFA IND INC·Filed 2023·Application pending·0 cites
- 1049US2023325578A1Methods of determining an effect of electronic component placement accuracy on wire loops in a semiconductor package, and related methodsKULICKE & SOFFA IND INC·Filed 2023·Application pending·0 cites
- 1139US2025372455A1Methods of imaging a wire structure on a wire bonding systemKULICKE & SOFFA IND INC·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →