Inventor · disambiguated record

Bae-Seung Park

Also filed as: PARK BAE-SEUNG

3 granted patents·85 citations·filing 1998–2000

75Inventor score

Technology areasH10P

Files withSAMSUNG ELECTRONICS CO LTD3

Top patents by PatentIndex Score

3 records

0169US6039830AMethod of and apparatus for laminating a semiconductor wafer with protective tapeSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Mar 21, 2000·39 cites·33 claims
0268US6193586B1Method and apparatus for grinding wafers using a grind chuck having high elastic modulusSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Feb 27, 2001·35 cites·11 claims
0365US6629876B1Apparatus for grinding wafers using a grind chuck having a high elastic modulusSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Oct 7, 2003·11 cites·9 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →