Inventor · disambiguated record
Barry C. Snyder
Also filed as: SNYDER BARRY C · SNYDER BARRY CRAIG
6 granted patents·151 citations·filing 2001–2009
81Inventor score
Top patents by PatentIndex Score
6 records- 0193US6716737B2Method of forming a through-substrate interconnectHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Apr 6, 2004·133 cites·32 claims
- 0262US6902872B2Method of forming a through-substrate interconnectHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Jun 7, 2005·11 cites·38 claims
- 0354US8174094B2Bonded structures formed by plasma enhanced bondingCHEN CHIEN-HUA·Filed 2009·Granted May 8, 2012·0 cites·10 claims
- 0449US7563691B2Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bondingHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Jul 21, 2009·3 cites·28 claims
- 0549US7432582B2Method of forming a through-substrate interconnectHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Oct 7, 2008·4 cites·21 claims
- 0628US6659592B2Multiple redundant through hole electrical interconnects and method for forming the sameHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Dec 9, 2003·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →