Inventor · disambiguated record
Balehithlu Manjappaiah Upendra
Also filed as: UPENDRA BALEHITHLU MANJAPPAIAH
3 granted patents·1 pending application·3 citations·filing 2019–2023
54Inventor score
Top patents by PatentIndex Score
4 records- 0177US11699647B2Pre-molded lead frames for semiconductor packagesINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jul 11, 2023·1 cites·20 claims
- 0272US11189592B2Multi-clip structure for die bondingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Nov 30, 2021·2 cites·12 claims
- 0348US2023307328A1Pre-molded lead frames for semiconductor packagesINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0447US12211770B2Semiconductor package and lead frame with enhanced device isolationINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Jan 28, 2025·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →