Inventor · disambiguated record
Bang-Li Wu
Also filed as: WU BANG · Wu bang-li
0 granted patents·12 pending applications·0 citations·filing 2024–2025
Top patents by PatentIndex Score
12 records- 0175US2025343084A1Integrated circuit packages and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0274US2025357270A1Integrated Circuit Package Structure with Thermelectric Self-Cooling DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0372US2025343103A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0472US2025336769A1Structure and formation method of package with heat-spreading lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0571US2025210420A1Integrated circuit packages and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0668US2025201668A1Structure and formation method of package with heat-spreading lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0767US2025218895A1Integrated Circuit Package Structure with Thermelectric Self-Cooling DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0867US2025201658A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0960US2025365246A1Data transmission method and apparatus, device, and storage mediumHUAWEI TECH CO LTD·Filed 2025·Application pending·0 cites
- 1056US2025372475A1Heat-Dissipating Lid ModuleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1156US2025351293A1Dynamic liquid cooling for integrated deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1255US2025309071A1Spacer frame for graphite thermal interface materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →