Inventor · disambiguated record
Baoquan Wu
Also filed as: WU BAOQUAN
12 granted patents·4 pending applications·16 citations·filing 2016–2022
83Inventor score
Top patents by PatentIndex Score
16 records- 0190US11403869B2Optical fingerprint identification apparatus and electronic deviceSHENZHEN GOODIX TECH CO LTD·Filed 2019·Granted Aug 2, 2022·9 cites·20 claims
- 0284US11403870B2Fingerprint identification apparatus and electronic deviceSHENZHEN GOODIX TECH CO LTD·Filed 2021·Granted Aug 2, 2022·2 cites·20 claims
- 0380US10784298B2Optical module, fabrication method thereof, and terminal device using the sameSHENZHEN GOODIX TECH CO LTD·Filed 2019·Granted Sep 22, 2020·5 cites·7 claims
- 0458US11816920B2Fingerprint identification apparatus and electronic deviceSHENZHEN GOODIX TECH CO LTD·Filed 2022·Granted Nov 14, 2023·0 cites·20 claims
- 0555US11321957B2Optical fingerprint apparatus and electronic deviceSHENZHEN GOODIX TECH CO LTD·Filed 2020·Granted May 3, 2022·0 cites·12 claims
- 0653US10350869B2Fingerprint identification module and method for manufacturing the sameSHENZHEN GOODIX TECH CO LTD·Filed 2017·Granted Jul 16, 2019·0 cites·9 claims
- 0749US11646278B2Package structure and packaging methodSHENZHEN GOODIX TECH CO LTD·Filed 2020·Granted May 9, 2023·0 cites·10 claims
- 0849US9831216B2Chip packaging moduleSHENZHEN GOODIX TECH CO LTD·Filed 2016·Granted Nov 28, 2017·0 cites·9 claims
- 0941US10810402B2Method for fabricating fingerprint identification apparatusSHENZHEN GOODIX TECH CO LTD·Filed 2018·Granted Oct 20, 2020·0 cites·8 claims
- 1041US10770413B2Chip packaging structure and method, and electronic deviceSHENZHEN GOODIX TECH CO LTD·Filed 2018·Granted Sep 8, 2020·0 cites·15 claims
- 1139US10810400B2Fingerprint identification module and package structure of fingerprint identification chipSHENZHEN GOODIX TECH CO LTD·Filed 2018·Granted Oct 20, 2020·0 cites·14 claims
- 1239US2019026525A1Optical fingerprint sensor and packaging method of optical fingerprint sensorSHENZHEN GOODIX TECH CO LTD·Filed 2018·Application pending·0 cites
- 1338US11183414B2Secondary packaging method and secondary package of through silicon via chipSHENZHEN GOODIX TECHOLOGY CO LTD·Filed 2018·Granted Nov 23, 2021·0 cites·11 claims
- 1438US2021050330A1Chip interconnection structure, chip, and chip interconnection methodSHENZHEN GOODIX TECH CO LTD·Filed 2020·Application pending·0 cites
- 1537US2018102261A1Chip packaging structure and chip packaging methodSHENZHEN GOODIX TECH CO LTD·Filed 2017·Application pending·0 cites
- 1636US2017338191A1Through silicon via chip and manufacturing method thereof, fingerprint identification sensor and terminal deviceSHENZHEN GOODIX TECH CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →