Inventor · disambiguated record
Ban-Li Wu
Also filed as: WU BAN-LI
20 granted patents·7 pending applications·36 citations·filing 2018–2025
91Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD27
Top patents by PatentIndex Score
27 records- 0195US11004786B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·10 cites·20 claims
- 0295US10832985B2Sensor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 10, 2020·12 cites·20 claims
- 0394US11929318B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·2 cites·20 claims
- 0493US11374136B2Semiconductor package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·3 cites·20 claims
- 0590US11742254B2Sensor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 29, 2023·2 cites·20 claims
- 0689US10840227B2Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 17, 2020·5 cites·20 claims
- 0786US12362274B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 0886US12261092B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 25, 2025·1 cites·20 claims
- 0985US2025273565A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1083US12334434B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 1179US2025357246A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1276US2024088307A1Semiconductor package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1376US2025329665A1Dielectric Slots Underneath Conductive Vias in Interconnect Structure of Semiconductor Package and Method of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1474US11855232B2Semiconductor package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·13 claims
- 1571US10861841B2Semiconductor device with multiple polarity groupsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·1 cites·20 claims
- 1670US12015017B2Package structure, package-on-package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·20 claims
- 1768US12406941B2Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 2, 2025·0 cites·20 claims
- 1868US2025191990A1Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1965US11527525B2Semiconductor device with multiple polarity groupsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·0 cites·20 claims
- 2065US2023420331A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2164US12205860B2Sensor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 2263US11049850B2Methods of bonding the strip-shaped under bump metallization structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 29, 2021·0 cites·20 claims
- 2362US11631658B2Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 18, 2023·0 cites·20 claims
- 2458US10658348B2Semiconductor devices having a plurality of first and second conductive stripsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 19, 2020·0 cites·20 claims
- 2557US11842993B2Semiconductor device with multiple polarity groupsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 12, 2023·0 cites·20 claims
- 2657US11011501B2Package structure, package-on-package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 18, 2021·0 cites·20 claims
- 2757US2023253384A1Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →