Inventor · disambiguated record
Baoguan Yin
Also filed as: YIN BAOGUAN
6 granted patents·3 citations·filing 2011–2019
68Inventor score
Technology areasH10W
Files withLUO JUNHUA2YIN BAOGUAN2FREESCALE SEMICONDUCTOR INC1WEIFANG GOERTEK MICROELECTRONICS CO LTD1
Top patents by PatentIndex Score
6 records- 0166US8354739B2Thin semiconductor package and method for manufacturing sameFREESCALE SEMICONDUCTOR INC·Filed 2011·Granted Jan 15, 2013·3 cites·19 claims
- 0246US8722465B1Method of assembling semiconductor device including insulating substrate and heat sinkLUO JUNHUA·Filed 2014·Granted May 13, 2014·0 cites·10 claims
- 0344US8643170B2Method of assembling semiconductor device including insulating substrate and heat sinkLUO JUNHUA·Filed 2012·Granted Feb 4, 2014·0 cites·6 claims
- 0439US9093438B2Semiconductor device package with cap elementYIN BAOGUAN·Filed 2014·Granted Jul 28, 2015·0 cites·9 claims
- 0537US12002685B2Method for packaging chipWEIFANG GOERTEK MICROELECTRONICS CO LTD·Filed 2019·Granted Jun 4, 2024·0 cites·9 claims
- 0637US8836105B2Semiconductor device package with cap elementYIN BAOGUAN·Filed 2012·Granted Sep 16, 2014·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →