Inventor · disambiguated record
Bengt Ahl
Also filed as: AHL BENGT
9 granted patents·344 citations·filing 1997–2002
90Inventor score
Technology areasH10W
Files withERICSSON INC3ERICSSON TELEFON AB L M2INFINEON TECHNOLOGIES AG2ERICCSON INC1ERICSSON GE MOBILE INC1
Top patents by PatentIndex Score
9 records- 0195US5933327AWire bond attachment of a integrated circuit package to a heat sinkERICSSON GE MOBILE INC·Filed 1998·Granted Aug 3, 1999·220 cites·6 claims
- 0275US6392298B1Functional lid for RF power packageERICSSON INC·Filed 2000·Granted May 21, 2002·24 cites·18 claims
- 0367US6583673B2Stability enhanced multistage power amplifierINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jun 24, 2003·15 cites·4 claims
- 0464US6777791B2Multiple ground signal path LDMOS power packageINFINEON TECHNOLOGIES AG·Filed 2002·Granted Aug 17, 2004·14 cites·21 claims
- 0563US6160710ACapacitive mounting arrangement for securing an integrated circuit package to a heat sinkERICSSON INC·Filed 1998·Granted Dec 12, 2000·30 cites·5 claims
- 0657US6580316B2Power transistor module, power amplifier and methods in the fabrication thereofERICSSON TELEFON AB L M·Filed 2000·Granted Jun 17, 2003·8 cites·24 claims
- 0755US6181006B1Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sinkERICSSON INC·Filed 1998·Granted Jan 30, 2001·20 cites·16 claims
- 0845US5869897AMounting arrangement for securing an intergrated circuit package to heat sinkERICCSON INC·Filed 1997·Granted Feb 9, 1999·12 cites·13 claims
- 0943US6501159B2Power transistor module, power amplifier and method in the fabrication thereofERICSSON TELEFON AB L M·Filed 2000·Granted Dec 31, 2002·1 cites·28 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →